Publications

Summary: TCAD (97), DAC (62), ICCAD (64), etc.

Journal & Conference Papers

Accepted

  • [J163] Donger Luo, Qi Sun, Peng Xu, Su Zheng, Qi Xu, Tinghuan Chen, Bei Yu, Hao Geng, “Attention-Based EDA Tool Parameter Explorer: From Hybrid Parameters to Multi-QoR Metrics”, accepted by IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).

  • [J161] Yuyang Chen, Qi Sun, Su Zheng, Xinyun Zhang, Bei Yu, Hao Geng, “HyDAS: Hybrid Domain Deformed Attention for Selective Hotspot Detection”, accepted by IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).

  • [J159] Shanyi Li, Zhen Zhuang, Mingyu Liu, Weihua Sheng, Bei Yu, Tsung-Yi Ho, “HiePlace: Efficient Hierarchical PCB Placement”, accepted by IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).

  • [J148] Xufeng Yao, Wenqian Zhao, Qi Sun, Cheng Zhuo, Bei Yu, “High-level Synthesis Directives Design Optimization via Large Language Model”, accepted by ACM Transactions on Design Automation of Electronic Systems (TODAES).

  • [J137] Yuan Pu, Tinghuan Chen, Zhuolun He, Jiajun Qin, Chen Bai, Haisheng Zheng, Yibo Lin, Bei Yu, “IncreMacro: Incremental Macro Placement Refinement”, accepted by IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).

2025

  • [C295] Yuxuan Zhao, Feng Gu, Siting Liu, Peiyu Liao, Bei Yu, “H3D: Heterogeneous Resources Aware Global Router for Face-to-Face Bonded 3D ICs”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025.

  • [C294] Ziyi Wang, Fangzhou Liu, Tsung-Yi Ho, David Z. Pan, Bei Yu, “NUA-Timer: Pre-Synthesis Timing Prediction Under Non-Uniform Input Arrival Times”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025.

  • [C293] Shuo Yin, Jiahao Xu, Jiaxi Jiang, Mingjun Li, Yuzhe Ma, Tsung-Yi Ho, Bei Yu, “G-Contour: GPU Accelerated Contour Tracing For Large-Scale Layouts”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025.

  • [C292] Yuntao Lu, Mingjun Wang, Yihan Wen, Boyu Han, Jianan Mu, Huawei Li, Bei Yu, “VIRTUAL: Vector-based Dynamic Power Estimation via Decoupled Multi-Modality Learning”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025.

  • [C291] Yuan Pu, Yuhao Ji, Siying Yu, Zuodong Zhang, Zizheng Guo, Zhuolun He, Yibo Lin, David Z. Pan, Bei Yu, “GPU Acceleration for Versatile Buffer Insertion”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025.

  • [C290] Yuan Pu, Zhuolun He, Shutong Lin, Jiajun Qin, Xinyun Zhang, Hairuo Han, Haisheng Zheng, Yuqi Jiang, Cheng Zhuo, Qi Sun, David Z. Pan, Bei Yu, “MM-GRADE: A Multi-Modal EDA Tool Documentation QA Framework Leveraging Retrieval Augmented Generation”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025.

  • [C289] Yuhao Ji, Yuntao Lu, Zuodong Zhang, Zizheng Guo, Yibo Lin, Bei Yu, “DiffCCD: Differentiable Concurrent Clock and Data Optimization”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025.

  • [C288] Peiyu Liao, Yuxuan Zhao, Siting Liu, Bei Yu, “Ultrafast Density Gradient Accumulation in 3D Analytical Placement with Divergence Theorem”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025.

  • [C287] Shanyi Li, Zhen Zhuang, Siyuan Liang, Bei Yu, Tsung-Yi Ho, “MMPack: Multi-Mask Co-Design for Ultra-Large Wafer-Scale Package Integration”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025.

  • [C286] Leilei Jin, Rongliang Fu, Zhen Zhuang, Liang Xiao, Fangzhou Liu, Bei Yu, Tsung-Yi Ho, “ChronoTE: Crosstalk-Aware Timing Estimation for Routing Optimization via Edge-Enhanced GNNs”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025.

  • [C285] Jindong Tu, Yapeng Li, Peng Xu, Tuo Li, Guoqing Li, Zushuai Xie, Bei Yu, Tinghuan Chen, “RSizing: Robust Bayesian Optimization for Analog Circuit Sizing Under Process Variations”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025.

  • [C284] Zhen Wang, Hongquan He, Tao Wu, Xuming He, Qi Sun, Cheng Zhuo, Bei Yu, Jingyi Yu, Hao Geng, “LMLitho: A Large Vision Model-Driven Lithography Simulation Framework”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025.

  • [C283] Donger Luo, Tianyi Li, Xinheng Li, Qi Sun, Cheng Zhuo, Bei Yu, Jingyi Yu, Hao Geng, “LLM-Augmented Multi-Modal Fusion for SoC Design Space Exploration”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025.

  • [C282] Xiaogang Xu, Jiafei Wu, Qingsen Yan, Jiequan Cui, Richang Hong, Bei Yu, “Learnable Feature Patches and Vectors for Boosting Low-light Image Enhancement without External Knowledge”, IEEE International Conference on Computer Vision (ICCV), Honolulu, Oct. 19–23, 2025.

  • [C281] Tianyuan Qu, Longxiang Tang, Bohao PENG, Senqiao Yang, Bei Yu, Jiaya Jia, “Does Your Vision-Language Model Get Lost in the Long Video Sampling Dilemma?”, IEEE International Conference on Computer Vision (ICCV), Honolulu, Oct. 19–23, 2025.

  • [C280] Sitong Wu, Haoru Tan, Yukang Chen, Shaofeng Zhang, Jingyao Li, Bei Yu, Xiaojuan Qi, Jiaya Jia, “Mixture-of-Scores: Robust Image-Text Data Quality Score via Three Lines of Code”, IEEE International Conference on Computer Vision (ICCV), Honolulu, Oct. 19–23, 2025.

  • [C279] Yuntao Lu, Dehua Liang, Siting Liu, Yuhao Ji, Yu Zhang, Xuanqi Chen, Xia Lin, Jinlei Lu, Weihua Sheng, Bei Yu, “A Hybrid Optimization Framework for Power-Efficient Pulsed Latch Utilization in Clock Networks”, ACM/IEEE International Symposium on Machine Learning for CAD (MLCAD), Santa Cruz, Sep. 08–10, 2025.

  • [C278] Haoyuan Wu, Rui Ming, Haisheng Zheng, Zhuolun He, Bei Yu, “Efficient OpAmp Adaptation for Zoom Attention to Golden Contexts”, Association for Computational Linguistics (ACL), Vienna, July 27–Aug. 1st, 2025.

  • [C275] Xiaogang Xu, Kun Zhou, Tao Hu, Jiafei Wu, Ruixing Wang, Bei Yu, Hao Peng, “Low-Light Video Enhancement via Spatial-Temporal Consistent Decomposition”, International Joint Conference on Artificial Intelligence (IJCAI), Montreal, Aug. 16–22, 2025.

  • [C274] Shaoteng Liu, Tianyu Wang, Jui-Hsien Wang, Qing Liu, Zhifei Zhang, Joon-Young Lee, Yijun Li, Bei Yu, Zhe Lin, Soo Ye Kim, Jiaya Jia, “Generative Video Propagation”, IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), Nashville, Jun. 11–15, 2025. (video) (paper)

  • [C273] Bin Xia, Yuechen Zhang, Jingyao Li, Chengyao Wang, Yitong Wang, Xinglong Wu, Bei Yu, Jiaya Jia, “DreamOmni: Unified Image Generation and Editing”, IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), Nashville, Jun. 11–15, 2025. (paper)

  • [C271] Yuxuan Zhao, Peiyu Liao, Bei Yu, “3D-Flow: Flow-based Standard Cell Legalization for 3D ICs”, ACM/IEEE Design Automation Conference (DAC), San Francisco, Jun. 22–25, 2025. (paper) (slides) (poster)

  • [C270] Hongduo Liu, Chen BAI, Peng Xu, Lihao Yin, Xianzhi Yu, Hui-Ling Zhen, Mingxuan Yuan, Tsung-Yi Ho, Bei Yu, “LLMShare: Optimizing LLM Inference Serving with Hardware Architecture Exploration”, ACM/IEEE Design Automation Conference (DAC), San Francisco, Jun. 22–25, 2025. (paper) (slides) (poster)

  • [C269] Ziyang Yu, Peng Xu, Zixiao WANG, Binwu Zhu, Qipan Wang, Yibo Lin, Runsheng Wang, Bei Yu, Martin Wong, “SDM-PEB: Spatial-Depthwise Mamba for Enhanced Post-Exposure Bake Simulation”, ACM/IEEE Design Automation Conference (DAC), San Francisco, Jun. 22–25, 2025.

  • [C268] Su Zheng, Xiaoxiao Liang, Ziyang Yu, Yuzhe Ma, Bei Yu and Martin Wong, “Curvilinear Optical Proximity Correction via Cardinal Spline”, ACM/IEEE Design Automation Conference (DAC), San Francisco, Jun. 22–25, 2025.

  • [C267] Xun Jiang, Haoran Lu, Yuxuan Zhao, Jiarui Wang, Zizheng Guo, Heng Wu, Bei Yu, Sung Kyu Lim, Runsheng Wang, Ru Huang, Yibo Lin, “A Systematic Approach for Multi-Objective Double-Side Clock Tree Synthesis”, ACM/IEEE Design Automation Conference (DAC), San Francisco, Jun. 22–25, 2025.

  • [C266] Donger Luo, Qi Sun, Xinheng Li, Cheng Zhuo, Bei Yu, Hao Geng, “From Flatland to Forest: Exploring Pareto-optimal Design through RTL Hierarchy Trees”, ACM/IEEE Design Automation Conference (DAC), San Francisco, Jun. 22–25, 2025.

  • [C265] Yuyang Ye, Xiangfei Hu, Yuchen Liu, Peng Xu, Yu Gong, Tinghuan Chen, Hao Yan, Bei Yu, Longxing Shi, “Rank-based Multi-objective Approximate Logic Synthesis via Monte Carlo Tree Search”, ACM/IEEE Design Automation Conference (DAC), San Francisco, Jun. 22–25, 2025.

  • [C264] Mingjun Wang, Bin Sun, Jianan Mu, Feng Gu, Boyu Han, Tianmeng Yang, Xinyu Zhang, Silin Liu, Yihan Wen, Hui Wang, Gao Jun, Zhiteng Chao, Husheng Han, Zizhen Liu, Shengwen Liang, Jing Ye, Bei Yu, Xiaowei Li, Huawei Li, “MOSS: Multi-Modal Representation Learning on Sequential Circuits”, ACM/IEEE Design Automation Conference (DAC), San Francisco, Jun. 22–25, 2025.

  • [C263] Baohui Xie, Xinrui Zhu, Zhiyuan Lu, Yuan Pu, Tongkai Wu, Xiaofeng Zou, Bei Yu, Tinghuan Chen, “DSPlacer: DSP Placement for FPGA-based CNN accelerator”, ACM/IEEE Design Automation Conference (DAC), San Francisco, Jun. 22–25, 2025.

  • [C259] Haisheng Zheng, Haoyuan WU, Zhuolun He, Yuzhe Ma, Bei Yu, “iRw: An Intelligent Rewriting”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Lyon, France, Mar. 31–Apr. 02, 2025. (paper) (slides) (poster)


  • [J124] Hongduo Liu, Peiyu Liao, Mengchuan Zou, Bowen Pang, Xijun Li, Mingxuan Yuan, Tsung-Yi Ho, Bei Yu, “Layout Decomposition via Boolean Satisfiability”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 44, no. 03, pp. 1112–1125, 2025. (paper)

2024

  • [C240] Guojin Chen, Haoyu Yang, Haoxing Ren, Bei Yu and David Z. Pan, “Differentiable Edge-based OPC”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), New Jersey, Oct. 27–31, 2024. (paper) (slides)

  • [C197] Yu Zhang, Wei Lin, Sisi Chen, Qingyu Song, Jiaxun Lu, Yunfeng Shao, Bei Yu, Hong Xu, “Fed2Com: Towards Efficient Compression in Federated Learning”, IEEE International Conference on Computing, Networking and Communications (ICNC), Hawaii, Feb. 19–22, 2024.

  • [C196] Xingquan Li, Zengrong Huang, Simin Tao, Zhipeng Huang, Chunan Zhuang, Hao Wang, Yifan Li, Yihang Qiu, Guojie Luo, Huawei Li, Haihua Shen, Mingyu Chen, Dongbo Bu, Wenxing Zhu, Ye Cai, Xiaoming Xiong, Ying Jiang, Yi Heng, Peng Zhang, Bei Yu, Biwei Xie, Yungang Bao, “iEDA: An Open-source infrastructure of EDA”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024. (paper) (slides) (Invited Paper)

  • [C195] Xingquan Li, Simin Tao, Shijian Chen, Zhisheng Zeng, Zhipeng Huang, Hongxi Wu, Weiguo Li1, Zengrong Huang, Liwei Ni, Xueyan Zhao, He Liu, Shuaiying Long, Ruizhi Liu, Xiaoze Lin, Bo Yang, Fuxing Huang, Zonglin Yang, Yihang Qiu, Zheqing Shao, Jikang Liu, Yuyao Liang, Biwei Xie, Yungang Bao, Bei Yu, “iPD: An Open-source intelligent Physical Design Tool Chain”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024. (paper) (slides) (Invited Paper)


  • [J117] Jiequan Cui, Zhisheng Zhong, Zhuotao Tian, Shu Liu, Bei Yu, Jiaya Jia, “Generalized Parametric Contrastive Learning”, IEEE Transactions on Pattern Analysis and Machine Intelligence (TPAMI), vol. 46, no. 12, pp. 7463–7474, 2024. (paper)

2023

  • [C179] Su Zheng, Bei Yu, Martin Wong, “OpenILT: An Open Source Inverse Lithography Technique Framework”, IEEE International Conference on ASIC (ASICON), Nanjing, Oct. 24–27, 2023. (paper) (slides) (Invited Paper)


2022


  • [J71] Martin Rapp, Hussam Amrouch, Yibo Lin, Bei Yu, David Z. Pan, Marilyn Wolf, Jorg Henkel, “MLCAD: A Survey of Research in Machine Learning for CAD”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 10, pp. 3162–3181, 2022. (paper) (Keynote Paper)

  • [J64] Yibo Lin, Xiaohan Gao, Tinghuan Chen, Bei Yu, “Machine learning for digital circuit backend design”, Micro/nano Electronics and Intelligent Manufacturing, vol. 2, no. 3, 2022. (in Chinese) (paper)

  • [J61] Ran Chen, Wei Zhong, Haoyu Yang, Hao Geng, Fan Yang, Xuan Zeng, Bei Yu, “Faster Region-based Hotspot Detection”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 3, pp. 669–680, 2022. (code) (paper)

2021

  • [C118] Tinghuan Chen, Qi Sun, Bei Yu, “Machine Learning in Nanometer AMS Design for Reliability”, IEEE International Conference on ASIC (ASICON), Kunming, China, Oct. 26–29, 2021. (paper) (slides) (Invited Paper)

  • [C116] Wei Li, Guojin Chen, Haoyu Yang, Ran Chen, Bei Yu, “Learning Point Clouds in EDA”, ACM International Symposium on Physical Design (ISPD), Mar. 21–Mar. 24, 2021. (paper) (slides) (Invited Paper)

  • [C111] Hongjia Li, Mengshu Sun, Tianyun Zhang, Olivia Chen, Nobuyuki Yoshikawa, Bei Yu, Yanzhi Wang, Yibo Lin, “Towards AQFP-Capable Physical Design Automation”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Feb. 01–05, 2021. (paper)


  • [J58] Wei Li, Yuzhe Ma, Qi Sun, Lu Zhang, Yibo Lin, Iris Hui-Ru Jiang, Bei Yu, David Z. Pan, “OpenMPL: An Open Source Layout Decomposer”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 40, no. 11, pp. 2331–2344, 2021. (paper)

  • [J56] Guyue Huang, Jingbo Hu, Yifan He, Jialong Liu, Mingyuan Ma, Zhaoyang Shen, Juejian Wu, Yuanfan Xu, Hengrui Zhang, Kai Zhong, Xuefei Ning, Yuzhe Ma, Haoyu Yang, Bei Yu, Huazhong Yang, Yu Wang, “Machine Learning for Electronic Design Automation: A Survey”, ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 25, no. 5, 2021. (paper)

2020


2019

  • [C80] Bentian Jiang, Xiaopeng Zhang, Ran Chen, Gengjie Chen, Peishan Tu, Wei Li, Evangeline F. Y. Young, Bei Yu, “FIT: Fill Insertion Considering Timing”, ACM/IEEE Design Automation Conference (DAC), pp. 221:1–221:6, Las Vegas, NV, June 2–6, 2019. (paper) (slides) (poster)


2018


2017

  • [C57] Hang Zhang, Fengyuan Zhu, Haocheng Li, Evangeline F. Y. Young, Bei Yu, “Bilinear Lithography Hotspot Detection”, ACM International Symposium on Physical Design (ISPD), pp. 7–14, Portland, OR, Mar. 19–22, 2017. (paper) (Best Paper Award)


2016


2015


2014

2013


2012

  • [C13] Bei Yu, Jhih-Rong Gao, Duo Ding, Yongchan Ban, Jae-Seok Yang, Kun Yuan, Minsik Cho, David Z. Pan, “Dealing with IC Manufacturability in Extreme Scaling”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), pp. 240–242, San Jose, Nov. 5–8, 2012. (paper) (Embedded Tutorial paper)


2011

2010

2009



Books / Book Chapters

 

[B4] Haoyu Yang, Yibo Lin, Bei Yu, “Machine Learning for Mask Synthesis and Verification”, in Machine Learning Applications in Electronic Design Automation, Mark Ren eds., Springer, 2022. (paper)

 

[B3] Shiyan Hu, Bei Yu, “Big Data Analytics for Cyber-Physical Systems”, Springer, 2020.

 

[B2] Bei Yu, David Z. Pan, “Design for Manufacturability with Advanced Lithography”, Springer, 2016.

 

[B1] Bei Yu, David Z. Pan, “Layout Decomposition for Triple Patterning”, in Encyclopedia of Algorithms, M.-Y. Kao eds., Springer, 2015. (paper)


Dissertation

Newsletters

  • [N2] Bei Yu, Gilda Garreton, David Z. Pan, “Layout Compliance for Triple Patterning Lithography: An Iterative Approach”, SPIE Newsroom.