Professional Services

University Committee Assignments

• Chair, Internship and Industry Liaison, 2023–present.

• Member, CUHK CSE Department Graduate Panel, 2016–2023.

• Member, CUHK CSE Department Curriculum Committee, 2015–present.

Editorial Board

• Editor, IEEE Technical Committee on Cyber-Physical Systems (TC-CPS) Newsletter, 2019–present.

• Associate Editor, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2024–present.

• Associate Editor, ACM Transactions on Design Automation of Electronic Systems (TODAES), 2020–present.

• Associate Editor, Integration, the VLSI Journal, 2016–present.

• Associate Editor, IET Cyber-Physical Systems: Theory & Applications, 2016–2023.

Guest Editor

• IEEE Consumer Electronics Magazine Special Issue on ISVLSI

• IEEE Design & Test Special Issue on Machine Learning for CAD / EDA

• IEEE Transactions on Sustainable Computing (TSUSC) Special Issue on Sustainable Cyber-Physical Systems

• Integration, the VLSI Journal Special Issue on Emerging Technologies for System Level Design and Interconnects

• Integration, the VLSI Journal Special Issue on ASP-DAC 2017

• Journal of Parallel and Distributed Computing (JPDC) Special Issue on Scalable Cyber-Physical Systems

Selected Organizers

• Chair, IEEE Technical Committee on Secure and Dependable Measurement (TC-SDM), 2021–Present.

• Chair, ACM Student Research Competition at ICCAD, 2018, 2019.

• Assistant Vice President Publicity, IEEE CEDA, 2024–Present.

• Organizing Committee, ACM International Symposium on Physical Design (ISPD), 2026–.

• Organizing Committee, IEEE CEDA Hong Kong Chapter, 2017–2024.

• Organizing Committee, International System Design Contest at DAC, 2018, 2019.

• Organizing Committee, EDAthon, 2017, 2018, 2019, 2021, 2022 (Chair)

Selected PC Member

• TPC Co-Chair, International Symposium of EDA (ISEDA), 2025.

• TPC Co-Chair, ACM/IEEE Workshop on Machine Learning for CAD (MLCAD), 2019.

• AAAI Conference on Artificial Intelligence (AAAI), 2023, 2024, 2025.

• ACM/IEEE Workshop on Machine Learning for CAD (MLCAD), 2019, 2020, 2021, 2022, 2023, 2024, 2025.

• ACM/IEEE Design Automation Conference (DAC), 2016, 2017, 2018.

• ACM International Symposium on Physical Design (ISPD), 2017, 2018, 2019, 2020, 2023, 2024, 2025.

• ACM Great Lakes Symposium on VLSI (GLSVLSI), 2016, 2017, 2018 (CAD Track Chair).

• IEEE/ACM International Conference On Computer Aided Design (ICCAD), 2016, 2017, 2018, 2024.

• IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), 2020, 2021.

• IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), 2018, 2019, 2020, 2021, 2022 (DFM track chair), 2024 (DFM track chair), 2025 (DFM track chair), 2026 (DFM track chair).

• IEEE International Conference on Computer Design (ICCD), 2021, 2022.

• IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS), 2022 (Track Chair)

• IEEE International Conference on LLM-Aided Design (LAD), 2024, 2025.

• International Joint Conference on Artificial Intelligence (IJCAI), 2020.

• International Symposium on Integrated Circuits and Systems Design (SBCCI), 2018 (CAD Track Co-Chair), 2019 (CAD Track Chair).