Publications

Journal & Conference Papers

Selected Preprints

  • “Graph World Models: Concepts, Taxonomy, and Future Directions”. (arXiv) (zhuanzhi)

  • “UniMoCo: Unified Modality Completion for Robust Multi-Modal Embeddings”. (arXiv)

  • “Diversity or Precision? A Deep Dive into Next Token Prediction”. (arXiv)

  • “MGM-Omni: Scaling Omni LLMs to Personalized Long-Horizon Speech”. (arXiv) (Github)

  • “Grove MoE: Towards Efficient and Superior MoE LLMs with Adjugate Experts”. (arXiv)

  • “On the Evaluation of Generative Models in Distributed Learning Tasks”. (arXiv)

  • “Generative Distribution Distillation”. (arXiv)

Accepted

  • [J] Su Zheng, Zijian Ding, Chengyue Wang, Bei Yu, Martin Wong, Yizhou Sun, Jason Cong, “Enhancing ASIC HLS Design Optimization via Knowledge Transfer from FPGA HLS Models”, accepted by IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).

  • [J] Binwu Zhu, Bei Yu, “PCB-QA: A Task-Specific Question Answering Framework for Text-Centric Chip Datasheet Queries in PCB Design”, accepted by ACM Transactions on Design Automation of Electronic Systems (TODAES).

2026

  • [C] Yaohui Han, Rongliang Fu, Yanming Liu, Shuo Ren, Shuai Dong, Yunpeng Wang, Tinghuan Chen, Bei Yu, Tsung-Yi Ho, “Expert-level Leaf Cell Layout Generation via Preference-Optimized LLM”, International Conference on Machine Learning (ICML), Seoul, Jul. 6–11, 2026.

  • [C] Mingkang Zhu, Xi Chen, Bei Yu, Hengshuang Zhao, Jiaya Jia, “Stratified GRPO: Handling Structural Heterogeneity in Reinforcement Learning of LLM Search Agents”, International Conference on Machine Learning (ICML), Seoul, Jul. 6–11, 2026.

  • [C] Mingzi Wang, Lancheng Zou, Shuo Yin, Zhuolun He, Bei Yu, “S-Quant: Rethinking Weight Quantization with Seed-Based Generation”, International Conference on Machine Learning (ICML), Seoul, Jul. 6–11, 2026.

  • [C] Sitong Wu, Haoru Tan, Xichen Zhang, Bin Xia, Shaofeng Zhang, Xiaojuan Qi, Bei Yu, Jiaya Jia, “Beyond Majority Voting: Self-Reflective Test-Time Reinforcement Learning for LLM Reasoning”, International Conference on Machine Learning (ICML), Seoul, Jul. 6–11, 2026.

  • [C] Yanfang Liu, Mingjun Wang, Peng XU, Rongliang Fu, Bei Yu, Tsung-Yi Ho, “AnalogVerifier: A Neuro-Symbolic Framework for Analog Circuit Verification”, International Conference on Machine Learning (ICML), Seoul, Jul. 6–11, 2026.

  • [C] Yao Lai, Xuyuan Xiong, Zeyue Xue, Guojin Chen, Jing Wang, Xihui Liu, Rui Zhang, Robert D. Mullins, Bei Yu, Ping Luo, “Fast Inverse Lithography via GRPO Reinforced Flow Matching”, International Conference on Machine Learning (ICML), Seoul, Jul. 6–11, 2026.

  • [C] Yuqi Liu, Liangyu Chen, Jiazhen Liu, Mingkang Zhu, Zhisheng Zhong, Bei Yu, Jiaya Jia, “ViSurf: Visual Supervised-and-Reinforcement Fine-Tuning for Large Vision-and-Language Models”, International Conference on Machine Learning (ICML), Seoul, Jul. 6–11, 2026.

  • [C356] Zehua Pei, Hui-Ling Zhen, Lancheng Zou, Xianzhi Yu, Wulong Liu, Sinno Jialin Pan, Mingxuan Yuan, Bei Yu, “Analytical FFN-to-MoE Restructuring via Activation Pattern Analysis”, Association for Computational Linguistics (ACL), San Diego, July 2–7, 2026.

  • [C355] Sitong Wu, Haoru Tan, Xichen Zhang, Bin Xia, Wenhu Zhang, Xiaojuan Qi, Bei Yu, Jiaya Jia, “TRAC: Teacher-Guided Token Reward with Adaptive Calibration for Robust Policy Optimization in LLM Reasoning”, Association for Computational Linguistics (ACL), San Diego, July 2–7, 2026.

  • [C354] Yu Zhang, Peter Belcak, Shizhe Diao, Yonggan Fu, Shaona Ghosh, Morteza Mardani, Eileen Margaret Peters Long, Bei Yu, Pavlo Molchanov, “PROBE: PROcess-Based BEnchmark for Hallucination Detection”, Association for Computational Linguistics (ACL) Findings, San Diego, July 2–7, 2026.

  • [C353] Ziyang Yu, Shuo Yin, Su Zheng, Xiaoxiao Liang, Yuzhe Ma, Bei Yu, “Coordinated Clip-Wise Gradient Scheduling for Full-Chip ILT via Policy Learning”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C352] Fangzhou Liu, Wuqian Tang, Bo-Ying Wang, An-Chieh Shen, Han-Wen Tsao, Yuyang Ye, Yun Shao, Chun-Yao Wang, Bei Yu, “HyPAS: A Hybrid Optimization Framework for Placement and Sizing Co-Optimization”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C351] Hongquan He, Ziyang Yu, Jiaqi Liu, Bei Yu, Jingyi Yu, Hao Geng, “CPW-SMO: Generating Mask Sets and Common Source for Maximum Common Process Window”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C350] Yuhao Ji, Yunqi Shi, Tianshu Hou, Yuxuan Zhao, Chunyuan Zhao, Peiyu Liao, Zizheng Guo, Chao Qian, Yibo Lin, Bei Yu, “Integrated Timing-driven Placement for Hybrid-Bonding-based Face-to-Face 3D ICs”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C349] Su Zheng, Xinyun Zhang, Bei Yu, Martin Wong, “DR. OPC: Differentiable Rasterization for Advanced Optical Proximity Correction”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C348] Haoyang Xu, Zheng Yang, Zhen Zhuang, Leilei Jin, Bei Yu, Sung Kyu Lim, Tsung-Yi Ho, “RTL-3D: Timing-aware Tier Partitioning for 3D ICs Using Pre-synthesis Timing Analysis”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C347] Peng Xu, Mingzi Wang, Yapeng Li, Yuyang Ye, Tinghuan Chen, Tsung-Yi Ho, Bei Yu, “DiffSP: Differentiable Sequence Pair-based Analog Placement”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C346] Shanyi Li, Leilei Jin, Siyuan Liang, Zhen Zhuang, Rongmei Chen, Bei Yu, Tsung-Yi Ho, “FlexiCTS: CPPR-Aware 3D Clock Tree Synthesis for Face-to-Face Bonded ICs”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C345] Leilei Jin, Haoyang Xu, Siyuan Liang, Zhen Zhuang, Zhou Hu, Zixiao Wang, Bei Yu, Rongmei Chen, Tsung-Yi Ho, “BSPDN-Elite: A Comprehensive Framework for Optimizing Timing, Power and Routing Resources in BSPDN Designs”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C344] Yaohui Han, Beichen Li, Mingyang Zhao, Rongliang Fu, Qunsong Ye, Tinghuan Chen, Bei Yu, Tsung-Yi Ho, “ModuPlace: LLM-Assisted Modular PCB Placement via Preference-Optimized Constraint Graph Generation”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C343] Bin Xia, Bohao Peng, Yuechen Zhang, Junjia Huang, JiyangLiu, Jingyao Li, Haoru Tan, Sitong Wu, Chengyao Wang, Yitong Wang, Bei Yu, Jiaya Jia, “DreamOmni2: Multimodal Instruction-based Generation and Editing”, IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), Denver, June 3–7, 2026. (Github) (media) (paper)

  • [C342] Sitong Wu, Haoru Tan, Bin Xia, Xichen Zhang, Jingyao Li, Shaofeng Zhang, Xiaojuan Qi, Bei Yu, Jiaya Jia, “Unlocking Token Rewards via Training-Free Reward Attribution”, IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), Denver, June 3–7, 2026. (paper)

  • [C341] Yu Zhang, Hui-Ling Zhen, Zehua Pei, Yingzhao Lian, Lihao Yin, Mingxuan Yuan, Bei Yu, “DiLA: Enhancing LLM Tool Learning with Differential Logic Layer”, SIGKDD Conference on Knowledge Discovery and Data Mining (KDD), Jeju, Korea, Aug. 9–13, 2026. (paper) (slides)

  • [C337] Wendong Xu, Jing Xiong, Chenyang Zhao, Qiujiang Chen, Haoran Wang, Hui Shen, Zhongwei Wan, Jianbo Dai, Taiqiang Wu, He Xiao, Chaofan Tao, Zhuoqing Mao, Ying Sheng, Zhijiang Guo, Hongxia Yang, Bei Yu, Lingpeng Kong, Quanquan Gu, Ngai Wong, “SwingArena: Adversarial Programming Arena for Long-context GitHub Issue Solving”, International Conference on Learning Representations (ICLR), Rio de Janeiro, Brazil, Apr. 23–27, 2026. (paper) (Oral)

  • [C336] Yuhao Ji, Zizheng Guo, Yibo Lin, Bei Yu, “HeteroSTA3D: A CPU-GPU Heterogeneous Static Timing Analysis Engine for 3D ICs”, Conference of Science & Technology for Integrated Circuits (CSTIC), Shanghai, Mar. 22–24, 2026. (paper) (slides) (Invited Paper)

  • [C335] Yuyang Ye, Che-Kuan Shen, Xiangfei Hu, Yuchen Liu, Shuo Yin, Xufeng Yao, Tsung-Yi Ho, Bei Yu, “LongRTL: Graph-Similarity-Guided LLM-driven Long Context RTL Optimization”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (slides)

  • [C334] Siting Liu, Peng Xu, Peiyu Liao, Keren Zhu, Yibo Lin, Bei Yu, “Submodular Maximization-inspired Adaptive Routing Bend Space Planning”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (slides)

  • [C333] Zixiao Wang, Tianshu Hou, Chenghan Wang, Zhen Zhuang, Tsung-Yi Ho, Farzan Farnia, Bei Yu, “FastRW: An Efficient Random Walk Method for Steady-State Thermal Analysis”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (slides)

  • [C332] Zixiao Wang, Jieya Zhou, Xinyun Zhang, Shoubo Hu, Farzan Farnia, Bei Yu, “DiffResist: Physics-Constrained Diffusion for Photoresist Modeling”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (slides)

  • [C331] Peng Xu, Ziyang Yu, Yuan Pu, Xinyun Zhang, Donger Luo, Hao Geng, Siyuan Xu, Tsung-Yi Ho, Bei Yu, “RATuner: Retrieval-Augmented VLSI Flow Design Parameter Tuning Framework”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (slides)

  • [C330] Su Zheng, Ziyang Yu, Bei Yu, Martin Wong, “Scalable Second-Order Optimizer for Full-Chip Inverse Lithography Techniques”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (slides)

  • [C329] Shixin Chen, Peng Xu, Yapeng Li, Tinghuan Chen, Bei Yu, “IP-Matcher: An Efficient One-to-Many Matching Framework for Analog Circuit Design and Reusing”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (slides)

  • [C328] Lancheng Zou, Sing Sen YE, Shuo Yin, Yuan Pu, Jiaxi Jiang, Siting Liu, Yuxuan Zhao, Bei Yu, “IncreMacro-3D: Incremental Macro Placement for Face-to-Face Stacked Memory-on-Logic 3D ICs”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (slides)

  • [C327] Wendong Xu, Chujie Chen, He Xiao, Kuan Li, Jing Xiong, Chen Zhang, Wenyong Zhou, Chaofan Tao, Yang Bai, Bei Yu, Ngai Wong, “AnchorTP: Resilient LLM Inference with State-Preserving Elastic Tensor Parallelism”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (slides)

  • [C326] Mengjia Dai, Hongduo Liu, Yuhao Ji, Xiaojing Su, Yibo Lin, Bei Yu, “Soft-Constrained Triple Patterning Layout Decomposition”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (slides)

  • [C325] Jiajun Qin, Cheng Tan, Ruihong Yin, Tianhua Xia, Sai Qian Zhang, Bei Yu, “FLAME: A Framework Exploring Execution Strategies for Multi-Cycle Operations in CGRA”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (slides)

  • [C324] Rongliang Fu, Wei Xuan, Shuo Yin, Guangyu Hu, Chen Chen, Hongce Zhang, Bei Yu, Tsung-Yi Ho, “eLogic: A E-Graph-based Logic Rewriting Framework for Majority-Inverter Graphs”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper)

  • [C323] Yaohui Han, Beichen Li, Rongliang Fu, Qunsong Ye, Zhiyuan Lu, Junchen Liu, Bei Yu, Tsung-Yi Ho, Tinghuan Chen, “PCB-Migrator: Automated PCB PnR Migration”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (slides)

  • [C322] Zhenghao Chen, Yuan Pu, Hairuo Han, Yuntao Nie, Jiajun Qin, Yuhan Qin, Tairu Qiu, Zhuolun He, Jianwang Zhai, Bei Yu, Kang Zhao, “MAEDA: An LLM-Powered Multi-Agent Evaluation Framework for EDA Tool Documentation QA”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper)

  • [C321] Wenbo Xu, Silin Chen, Yibo Huang, Xinyun Zhang, Zixiao WANG, Bei Yu, Ningmu Zou, “Node2Node: Node Adaptation with Transformer for Cross-Node Hotspot Detection”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper)

  • [C320] Zhiteng Chao, Yonghao Wang, Xinyu Zhang, Jiaxin Zhou, Tenghui Hua, Husheng Han, Tianmeng Yang, Jianan Mu, Bei Yu, Rui Zhang, Jing Ye, Huawei Li, “Think with Self-Decoupling and Self-Verification: Automated RTL Design with Backtrack-ToT”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper)

  • [C319] Zhaohai Di, Jindong Tu, Zhiyuan HE, Yuan Pu, Jiawei Liu, Chong Tong, Tsung-Yi Ho, Bei Yu, Tinghuan Chen, “Smart-PCLib: A LLM-based Multi-Agent Framework for Automated PCB Component Library Generation”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (slides) (Best Paper Award Nomination)

  • [C318] Xinheng Li, Donger Luo, Peng Xu, Ziyang Yu, Qi Sun, Tinghuan Chen, Bei Yu, Hao Geng, “EDA Flow Matters: Stage-Aware Parameter Optimization of Tool Chain”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper)

  • [C317] Qinggong Shen, Chaoli Zhang, Haoyang Xu, Zhiwen Yu, Bin Guo, Yuxuan Zhao, Bei Yu, Tsung-Yi Ho, Xing Huang, “HPPlacer: A High-Precision Slack-Aware Global Placement Engine”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (slides)

  • [C316] Bohao Li, Ranran Liu, Yumeng Liu, Cong Jiang, Kang Liu, Bei Yu, Kun Ren, Qi Sun, Cheng Zhuo, “Lithography Hotspot Detection for Complex Non-Manhattan Layouts via Graph Neural Network”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (Best Paper Award Nomination)

  • [C307] Shuo Ren, Zhen Zhuang, Rongliang Fu, Leilei Jin, Libo Shen, Bei Yu, Tsung-Yi Ho, “Partitioning-free 3D-IC Floorplanning”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Hong Kong, Jan. 19–22, 2026. (paper) (slides)


  • [J166] Hongduo Liu, Siting Liu, Zhongdong Qi, Tsung-Yi Ho, Bei Yu, “Selecting Nets to Rip Up and Reroute via SAT”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 45, no. 05, pp. 2136–2140, 2026. (paper)

  • [J156] Shanyi Li, Zhen Zhuang, Mingyu Liu, Weihua Sheng, Bei Yu, Tsung-Yi Ho, “HiePlace: Efficient Hierarchical PCB Placement”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 45, no. 01, pp. 428–440, 2026. (paper)

2025

  • [C281] Shuo Yin, Su Zheng, Ziyang Yu, Bei Yu, “TorchLitho 2.0: Ultrafast Differentiable Lithography Simulation Engine”, IEEE International Conference on ASIC (ASICON), Kunming, Oct. 21–24, 2025. (paper) (slides) (code) (Invited Paper)

  • [C280] Ziyang Yu, Bei Yu, “Large-Scale VLSI Mask Optimization: A Survey”, International Workshop on Advanced Patterning Solutions (IWAPS), Shenzhen, Oct. 14–15, 2025. (paper) (slides) (Keynote Paper)

  • [C274] Shaoteng Liu, Tianyu Wang, Jui-Hsien Wang, Qing Liu, Zhifei Zhang, Joon-Young Lee, Yijun Li, Bei Yu, Zhe Lin, Soo Ye Kim, Jiaya Jia, “Generative Video Propagation”, IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), Nashville, Jun. 11–15, 2025. (video) (paper)

  • [C273] Bin Xia, Yuechen Zhang, Jingyao Li, Chengyao Wang, Yitong Wang, Xinglong Wu, Bei Yu, Jiaya Jia, “DreamOmni: Unified Image Generation and Editing”, IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), Nashville, Jun. 11–15, 2025. (paper)

  • [C259] Haisheng Zheng, Haoyuan WU, Zhuolun He, Yuzhe Ma, Bei Yu, “iRw: An Intelligent Rewriting”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Lyon, France, Mar. 31–Apr. 02, 2025. (paper) (slides) (poster)


  • [J137] Yuan Pu, Tinghuan Chen, Zhuolun He, Jiajun Qin, Chen Bai, Haisheng Zheng, Yibo Lin, Bei Yu, “IncreMacro: Incremental Macro Placement Refinement”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 44, no. 08, pp. 3222–3235, 2025. (paper)

  • [J124] Hongduo Liu, Peiyu Liao, Mengchuan Zou, Bowen Pang, Xijun Li, Mingxuan Yuan, Tsung-Yi Ho, Bei Yu, “Layout Decomposition via Boolean Satisfiability”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 44, no. 03, pp. 1112–1125, 2025. (paper)

2024

  • [C240] Guojin Chen, Haoyu Yang, Haoxing Ren, Bei Yu and David Z. Pan, “Differentiable Edge-based OPC”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), New Jersey, Oct. 27–31, 2024. (paper) (slides)

  • [C197] Yu Zhang, Wei Lin, Sisi Chen, Qingyu Song, Jiaxun Lu, Yunfeng Shao, Bei Yu, Hong Xu, “Fed2Com: Towards Efficient Compression in Federated Learning”, IEEE International Conference on Computing, Networking and Communications (ICNC), Hawaii, Feb. 19–22, 2024.

  • [C196] Xingquan Li, Zengrong Huang, Simin Tao, Zhipeng Huang, Chunan Zhuang, Hao Wang, Yifan Li, Yihang Qiu, Guojie Luo, Huawei Li, Haihua Shen, Mingyu Chen, Dongbo Bu, Wenxing Zhu, Ye Cai, Xiaoming Xiong, Ying Jiang, Yi Heng, Peng Zhang, Bei Yu, Biwei Xie, Yungang Bao, “iEDA: An Open-source infrastructure of EDA”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024. (paper) (slides) (Invited Paper)

  • [C195] Xingquan Li, Simin Tao, Shijian Chen, Zhisheng Zeng, Zhipeng Huang, Hongxi Wu, Weiguo Li1, Zengrong Huang, Liwei Ni, Xueyan Zhao, He Liu, Shuaiying Long, Ruizhi Liu, Xiaoze Lin, Bo Yang, Fuxing Huang, Zonglin Yang, Yihang Qiu, Zheqing Shao, Jikang Liu, Yuyao Liang, Biwei Xie, Yungang Bao, Bei Yu, “iPD: An Open-source intelligent Physical Design Tool Chain”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024. (paper) (slides) (Invited Paper)


  • [J117] Jiequan Cui, Zhisheng Zhong, Zhuotao Tian, Shu Liu, Bei Yu, Jiaya Jia, “Generalized Parametric Contrastive Learning”, IEEE Transactions on Pattern Analysis and Machine Intelligence (TPAMI), vol. 46, no. 12, pp. 7463–7474, 2024. (paper)

2023

  • [C179] Su Zheng, Bei Yu, Martin Wong, “OpenILT: An Open Source Inverse Lithography Technique Framework”, IEEE International Conference on ASIC (ASICON), Nanjing, Oct. 24–27, 2023. (paper) (slides) (Invited Paper)


2022


  • [J71] Martin Rapp, Hussam Amrouch, Yibo Lin, Bei Yu, David Z. Pan, Marilyn Wolf, Jorg Henkel, “MLCAD: A Survey of Research in Machine Learning for CAD”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 10, pp. 3162–3181, 2022. (paper) (Keynote Paper)

  • [J64] Yibo Lin, Xiaohan Gao, Tinghuan Chen, Bei Yu, “Machine learning for digital circuit backend design”, Micro/nano Electronics and Intelligent Manufacturing, vol. 2, no. 3, 2022. (in Chinese) (paper)

  • [J61] Ran Chen, Wei Zhong, Haoyu Yang, Hao Geng, Fan Yang, Xuan Zeng, Bei Yu, “Faster Region-based Hotspot Detection”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 3, pp. 669–680, 2022. (code) (paper)

2021

  • [C118] Tinghuan Chen, Qi Sun, Bei Yu, “Machine Learning in Nanometer AMS Design for Reliability”, IEEE International Conference on ASIC (ASICON), Kunming, China, Oct. 26–29, 2021. (paper) (slides) (Invited Paper)

  • [C116] Wei Li, Guojin Chen, Haoyu Yang, Ran Chen, Bei Yu, “Learning Point Clouds in EDA”, ACM International Symposium on Physical Design (ISPD), Mar. 21–Mar. 24, 2021. (paper) (slides) (Invited Paper)

  • [C111] Hongjia Li, Mengshu Sun, Tianyun Zhang, Olivia Chen, Nobuyuki Yoshikawa, Bei Yu, Yanzhi Wang, Yibo Lin, “Towards AQFP-Capable Physical Design Automation”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Feb. 01–05, 2021. (paper)


  • [J58] Wei Li, Yuzhe Ma, Qi Sun, Lu Zhang, Yibo Lin, Iris Hui-Ru Jiang, Bei Yu, David Z. Pan, “OpenMPL: An Open Source Layout Decomposer”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 40, no. 11, pp. 2331–2344, 2021. (paper)

  • [J56] Guyue Huang, Jingbo Hu, Yifan He, Jialong Liu, Mingyuan Ma, Zhaoyang Shen, Juejian Wu, Yuanfan Xu, Hengrui Zhang, Kai Zhong, Xuefei Ning, Yuzhe Ma, Haoyu Yang, Bei Yu, Huazhong Yang, Yu Wang, “Machine Learning for Electronic Design Automation: A Survey”, ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 25, no. 5, 2021. (paper)

2020


2019

  • [C80] Bentian Jiang, Xiaopeng Zhang, Ran Chen, Gengjie Chen, Peishan Tu, Wei Li, Evangeline F. Y. Young, Bei Yu, “FIT: Fill Insertion Considering Timing”, ACM/IEEE Design Automation Conference (DAC), pp. 221:1–221:6, Las Vegas, NV, June 2–6, 2019. (paper) (slides) (poster)


2018


2017

  • [C57] Hang Zhang, Fengyuan Zhu, Haocheng Li, Evangeline F. Y. Young, Bei Yu, “Bilinear Lithography Hotspot Detection”, ACM International Symposium on Physical Design (ISPD), pp. 7–14, Portland, OR, Mar. 19–22, 2017. (paper) (Best Paper Award)


2016


2015


2014

2013


2012

  • [C13] Bei Yu, Jhih-Rong Gao, Duo Ding, Yongchan Ban, Jae-Seok Yang, Kun Yuan, Minsik Cho, David Z. Pan, “Dealing with IC Manufacturability in Extreme Scaling”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), pp. 240–242, San Jose, Nov. 5–8, 2012. (paper) (Embedded Tutorial paper)


2011

2010

2009



Books / Book Chapters

 

[B4] Haoyu Yang, Yibo Lin, Bei Yu, “Machine Learning for Mask Synthesis and Verification”, in Machine Learning Applications in Electronic Design Automation, Mark Ren eds., Springer, 2022. (paper)

 

[B3] Shiyan Hu, Bei Yu, “Big Data Analytics for Cyber-Physical Systems”, Springer, 2020.

 

[B2] Bei Yu, David Z. Pan, “Design for Manufacturability with Advanced Lithography”, Springer, 2016.

 

[B1] Bei Yu, David Z. Pan, “Layout Decomposition for Triple Patterning”, in Encyclopedia of Algorithms, M.-Y. Kao eds., Springer, 2015. (paper)


Dissertation

Newsletters

  • [N2] Bei Yu, Gilda Garreton, David Z. Pan, “Layout Compliance for Triple Patterning Lithography: An Iterative Approach”, SPIE Newsroom.