Publications

Journal & Conference Papers

Selected Preprints

  • “SynAct: A Reasoning-Acting Large Language Model Agent for Adaptive Synthesis Optimization”. (arXiv)

  • “Scaling Native Multimodal Pre-Training From Scratch”. (arXiv)

  • “PipeRTL: Timing-Aware Pipeline Optimization at IR-Level for RTL Generation”. (arXiv)

  • “Graph World Models: Concepts, Taxonomy, and Future Directions”. (arXiv) (zhuanzhi)

  • “UniMoCo: Unified Modality Completion for Robust Multi-Modal Embeddings”. (arXiv)

  • “On the Evaluation of Generative Models in Distributed Learning Tasks”. (arXiv)

  • “Generative Distribution Distillation”. (arXiv)

Accepted

  • [J] Su Zheng, Donger Luo, Yuyang Chen, Hao Geng, Bei Yu, Martin D.F. Wong, “PointDetector: Large-Scale Lithography Hotspot Detection via Point Cloud Classification”, accepted by ACM Transactions on Design Automation of Electronic Systems (TODAES).

  • [J] Yihan Wen, Lancheng Zou, Tianshu Hou, Bei Yu, “Power Trace-driven 3D-IC Floorplanning”, accepted by IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).

2027

  • [C407] Jiayu Zhao, Zehua Pei, Zetao Guo, Bei Yu, Song Chen, “VeriGRAG: Enhancing LLM-Based Verilog Code Generation with Structure-Aware Soft Prompts”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Tokyo, Jan. 25–28, 2027.

  • [C406] Jiahao Xu, Yuhao Ji, Yifan Shi, Zizheng Guo, Zuodong Zhang, Yibo Lin, Bei Yu, “Obstacle-Aware Timing-Driven Buffer Insertion via Feasible Shallow-Light Topology Reconstruction”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Tokyo, Jan. 25–28, 2027.

  • [C405] Zhongru Xiong, Mingjun Wang, Yanfang Liu, Tsung-Yi Ho, Bei Yu, Binwu Zhu, “HOIST: A High-Order Interaction Surrogate for Sample-Efficient High-Sigma Yield Estimation in High-Dimensional Circuits”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Tokyo, Jan. 25–28, 2027.

  • [C404] Yuhan Qin, Yuan Pu, Zhuolun He, Bei Yu, “FormalPCell: Formal DRC Verification of Parameterized Layout Cells via Symbolic Interpretation and SMT Solving”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Tokyo, Jan. 25–28, 2027.

  • [C403] Pengju Zhang, Ziyi Wang, Bei Yu, Zhiang Wang, “Learning-Augmented Multilevel Hypergraph Partitioning with Net-Level Cut Priors”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Tokyo, Jan. 25–28, 2027.

  • [C402] Fangzhou Liu, Yuhao Ji, Lancheng Zou, Jiawei Liu, Mingjun Wang, Gengjie Chen, Guannan Guo, Bei Yu, “Logic Resynthesis for Cross-Die Dependencies in Hybrid Bonded 3D ICs”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Tokyo, Jan. 25–28, 2027.

  • [C401] Jiaxi Jiang, Yuxuan Zhao, Zhen Zhuang, Siting Liu, Yuntao Lu, Yuhao Ji, Yifan Shi, Xuanqi Chen, Tsung-Yi Ho, Yibo Lin, Bei Yu, “MoL-PAM: Joint P/G TSV Planning and Macro Refinement for Memory-on-Logic 3D ICs via a Benders-Type Decomposition Heuristic”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Tokyo, Jan. 25–28, 2027.

  • [C400] Jiale Li, Silin Chen, Yufeng Zhang, Zhili Xu, Yiqing Wang, Wenbo Xu, Ziyang Yu, Bei Yu, Ningmu Zou, “Chain of SRAF Generation: A Large Reasoning Model for Sub-resolution Assist Features”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Tokyo, Jan. 25–28, 2027.

  • [C399] Debin Cao, Kanglin Tian, Ze Hao, Yi Huang, Bei Yu, Jianwang Zhai, Kang Zhao, “Thermal-Aware Chiplet Placement Integrating Evolutionary Reinforcement Learning and Monte Carlo Tree Search”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Tokyo, Jan. 25–28, 2027.

  • [C398] Shuao Jia, Zichao Ling, Chen Bai, Bei Yu, Kang Zhao, Jianwang Zhai, “FADiff: Fusion-Aware Differentiable Optimization for DNN Scheduling on Tensor Accelerators”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Tokyo, Jan. 25–28, 2027.

  • [C397] Shuo Ren, Zijin Cheng, Yaohui Han, Libo Shen, Leilei Jin, Wanting Tian, Rongliang Fu, Chao Wang, Bei Yu, Tsung-Yi Ho, “AgenticPD: A Stage-Aware Agentic Framework for Closed-Loop Physical Design Optimization”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Tokyo, Jan. 25–28, 2027.

2026

  • [C396] Mingkang Zhu, Xi Chen, Bei Yu, Hengshuang Zhao, Jiaya Jia, “Bias-Variance Optimized Preference Optimization for Large Reasoning Models”, Annual Conference on Neural Information Processing Systems (NeurIPS), Sydney/Atlanta/Paris, Dec. 6–13, 2026.

  • [C395] Zehua Pei, Hui-Ling Zhen, Weizhe Lin, Sinno Jialin Pan, Yunhe Wang, Mingxuan Yuan, Bei Yu, “MemDLM: Memory-Enhanced DLM Training”, Annual Conference on Neural Information Processing Systems (NeurIPS), Sydney/Atlanta/Paris, Dec. 6–13, 2026.

  • [C394] Sitong Wu, Haoru Tan, Bin Xia, Bei Yu, Xiaojuan Qi, Jiaya Jia, “Fast-RL: Accelerating Reinforcement Learning for LongCoT Reasoning Models”, Annual Conference on Neural Information Processing Systems (NeurIPS), Sydney/Atlanta/Paris, Dec. 6–13, 2026.

  • [C393] Sitong Wu, Haoru Tan, Bei Yu, Xiaojuan Qi, Jiaya Jia, “Historical Relative Policy Optimization for Bootstrapping LLM Reasoning”, Annual Conference on Neural Information Processing Systems (NeurIPS), Sydney/Atlanta/Paris, Dec. 6–13, 2026.

  • [C392] Senqiao Yang, Chengyao Wang, Yuxin Chen, Zixuan Wang, Longxiang Tang, Haokun GUI, Jinhui Ye, Changsheng Lu, Xiaoyang Wu, Mingkang Zhu, Pengguang Chen, Shu Liu, Zhuotao Tian, Hengshuang Zhao, Bei Yu, Jiaya Jia, “Beyond Data Scaling: Representation-Centric Pre-training for Vision-Language-Action Models”, Annual Conference on Neural Information Processing Systems (NeurIPS), Sydney/Atlanta/Paris, Dec. 6–13, 2026.

  • [C391] Yihan Wen, Su Zheng, Tianshu Hou, Shiping Wu, Yuzhou Feng, Bei Yu, “Disentangled Multimodal Learning for Scalable Dynamic IR-Drop Analysis”, Annual Conference on Neural Information Processing Systems (NeurIPS), Sydney/Atlanta/Paris, Dec. 6–13, 2026.

  • [C390] Siyuan Liang, Zixiao Wang, Chenghan Wang, Shanyi Li, Yushen Zhang, Leilei Jin, Zhen Zhuang, Ulf Schlichtmann, Bei Yu, Tsung-Yi Ho, “DiffCool: Label-Free Synthesis of Chip-Tailored Heat Sinks via Thermal-Aware Diffusion”, Annual Conference on Neural Information Processing Systems (NeurIPS), Sydney/Atlanta/Paris, Dec. 6–13, 2026.

  • [C389] Mengjia Dai, Hongduo Liu, Yuhao Ji, Xiaojing Su, Yibo Lin, Bei Yu, “Soft-Constrained Triple Patterning Layout Decomposition”, IEEE International Conference on Computer Design (ICCD), Nov. 16–18, Hong Kong, 2026.

  • [C388] Su Zheng, Shuo Yin, Ziyang Yu, Bei Yu, Martin Wong, “NODE-ILT: Learning the Neural Ordinary Differential Equation for Full-Chip Inverse Lithography Techniques”, IEEE International Conference on Computer Design (ICCD), Nov. 16–18, Hong Kong, 2026.

  • [C387] Yanfang Liu, Peng Xu, Yapeng Li, Mingjun Wang, Leilei Jin, Rongliang Fu, Tinghuan Chen, Wei Xing, Bei Yu, Tsung-Yi Ho, “MigSizer: Physical-aware Sizing Improving Analog/RF Circuit Migration”, IEEE International Conference on Computer Design (ICCD), Nov. 16–18, Hong Kong, 2026.

  • [C386] Shuo Yin, Yihe Wang, Lancheng Zou, Xufeng Yao, Tinghuan Chen, Chen Bai, Zhengrong Wang, Tsung-Yi Ho, Bei Yu, “CPPL: A Circuit Prompt Programming Language”, IEEE International Conference on Computer Design (ICCD), Nov. 16–18, Hong Kong, 2026. (arXiv)

  • [C385] Rui Ming, Haoyuan Wu, Shoubo Hu, Zhuolun He, Bei Yu, “One-Token Rollout: Guiding Supervised Fine-Tuning of LLMs with Policy Gradient”, Empirical Methods in Natural Language Processing (EMNLP), Budapest, Oct. 24–29, 2026.

  • [C384] Haoyuan Wu, Haoxing Chen, Xiaodong Chen, Zhanchao Zhou, Tieyuan Chen, Yihong Zhuang, Guoshan Lu, Zenan Huang, Junbo Zhao, Lin Liu, Zhenzhong Lan, Bei Yu, Jianguo Li, “Grove MoE: Towards Efficient and Superior MoE LLMs with Adjugate Experts”, Empirical Methods in Natural Language Processing (EMNLP), Budapest, Oct. 24–29, 2026. (arXiv)

  • [C383] Wuqian Tang, Zixiao Wang, Che-Chien Lin, Fong-Hua Fu, Laura Angélica Shion-Korsak, Xinyun Zhang, Bei Yu, Chun-Yao Wang, “TAPCO: LLM-Guided Design-Adaptive Timing and Power Co-Optimization”, ACM/IEEE International Symposium on Machine Learning for CAD (MLCAD), Jeju, Sep. 07–09, 2026. (Invited Paper)

  • [C382] Zixiao Wang, Leilei Jin, Zhen Zhuang, Rongmei Chen, Bei Yu, “CSCO: A Backside-PDN-Aware Clock-Signal Co-Optimization Framework for Improved PPA”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 08–12, 2026.

  • [C381] Shixin Chen, Peng Xu, Yapeng Li, Tinghuan Chen, Bei Yu, “PatchWork: A Patch-Driven Framework for Efficient Analog Layout Automation via Legacy Knowledge Reuse”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 08–12, 2026.

  • [C380] Yuan Pu, Yudong He, Zhenghao Chen, Mingjun Wang, Bingkun Yao, Zhaotan Lin, Qin Chen, Bing Li, Song Chen, Zhuolun He, Wenjian Yu, Yanfeng Li, Bei Yu, “ChatFCM: Comprehension-Synthesis Decoupling for LLM-Based Functional Coverage Model Generation”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 08–12, 2026.

  • [C379] Yuhao Ji, Siying Yu, Yunqi Shi, Fangzhou Liu, Yuxuan Zhao, Jiaxi Jiang, Zizheng Guo, Chao Qian, Yibo Lin, Bei Yu, “HeteroOpt3D: Timing Optimization for Heterogeneous Hybrid-bonding-based Face-to-Face 3D ICs”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 08–12, 2026.

  • [C378] Mengjia Dai, Ziyang Yu, Guojin Chen, Yuhao Ji, Bei Yu, “Multi-Mask Parametric Source Mask Optimization”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 08–12, 2026.

  • [C377] Jiajun Qin, Yuhao Ji, Zhaotan Lin, Cheng Tan, Xinyun Zhang, Bei Yu, “NUKE: An Automatic Pattern Fusion Framework for CGRAs using E-graphs”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 08–12, 2026.

  • [C376] Mingjun Wang, Lancheng Zou, Guanqi Li, Feng Gu, Yuntao Lu, Tianmeng Yang, Boyu Han, Jianan Mu, Huawei Li, Sung Kyu Lim, Bei Yu, “Distill3D: Cross-Stage Knowledge Distillation for Early-Stage 3D IC Timing Prediction”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 08–12, 2026.

  • [C375] Chaofan Wang, Ziyang Yu, Su Zheng, Zixiao Wang, Yifan Shi, Bei Yu, “Moreau-ILT: Efficient Inverse Lithography Exploiting Weak Convexity”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 08–12, 2026.

  • [C374] Zhen Zhuang, Siyuan Liang, Yuan Du, Li Du, Bei Yu, “Vertical PDN Routing and Embedded IVR Placement Co-Optimization for Advanced Packaging”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 08–12, 2026.

  • [C373] Yanfang Liu, Zijin Cheng, Mingjun Wang, Rongliang Fu, Chao Wang, Bei Yu, “LibPilot: Knowledge-Constrained Dual-Agent Reasoning for Standard Cell Library Tuning”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 08–12, 2026.

  • [C372] Yapeng Li, Peng Xu, Shixin Chen, Jindong Tu, Tongkai Wu, Chong Tong, Bei Yu, Tinghuan Chen, “AMigration: Analog placement Migration via Adaptive Constraints Relaxation”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 08–12, 2026.

  • [C371] Yuheng Huang, Yuhan Qin, Yuan Pu, Zhaotan Lin, Yuntao Nie, Zhuolun He, Jianwang Zhai, Kang Zhao, Bei Yu, “A Multi-Granularity Retrieval Augmented Generation Framework for EDA Tasks Leveraging Knowledge Graph”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 08–12, 2026.

  • [C370] Xiangfei Hu, Lancheng Zou, Xilong Kang, Yuchen Liu, Jiajie Xu, Tairan Cheng, Yuyang Ye, Chang Meng, Hao Yan, Bei Yu, “PeLog: Rotation-Assisted Logarithmic Encoding for Low-Bit Large Language Model Quantization”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 08–12, 2026.

  • [C369] Siyang Chen, Yuan Pu, Yuhan Qin, Zhaotan Lin, Siyuan Liang, Zhuolun He, Lining Zhang, Bei Yu, “SGLayout: Schema-Guided Closed-Loop Refinement for LLM-Driven Parameterized Layout Generation”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 08–12, 2026.

  • [C368] Jincheng Lou, Ruohan Xu, Jiecheng Ma, Boyang Wu, Yuhao Ji, Chunyuan Zhao, Xinyu Qu, Yuxiang Zhao, Runzhe Tao, Bei Yu, Zhixiong Di, Yibo Lin, “LEGO 2.0: A Unified Agentic Platform for Digital Chip Design and Optimization”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 08–12, 2026.

  • [C367] Siying Yu, Yixun Hong, Guozhi Qiu, Feng Gu, Chenbo Geng, Zhengrong Wang, Chen Zhang, Bei Yu, “FlashGPU-sim: Enabling GPU Modeling for Modern Architectures and AI Workloads”, IEEE/ACM International Symposium on Microarchitecture (MICRO), Athens, Oct. 31–Nov. 04, 2026. (arXiv)

  • [C366] Zehua Pei, Ying Zhang, Hui-Ling Zhen, Tao Yuan, Xianzhi Yu, Zhenhua Dong, Sinno Jialin Pan, Mingxuan Yuan, Bei Yu, “PreMoE: Proactive Inference for Efficient Mixture-of-Experts”, Conference on Language Modeling (COLM), San Francisco, Oct. 6–9, 2026.

  • [C365] Haoyuan Wu, Hai Wang, Jiajia Wu, Jinxiang Ou, Keyao Wang, Weile Chen, Zihao Zheng, Bei Yu, “Diversity or Precision? A Deep Dive into Next Token Prediction”, Conference on Language Modeling (COLM), San Francisco, Oct. 6–9, 2026. (arXiv) (Oral Spotlight)

  • [C364] Zheng Zhu, Xiaozhuan Liang, Xi Chen, Bei Yu, Jiaya Jia, “Don’t Lose the Thread: Empowering Long-Horizon LLM Agents with Cognitive Resource Self-Allocation”, Conference on Language Modeling (COLM), San Francisco, Oct. 6–9, 2026.

  • [C350] Ziyang Yu, Shuo Yin, Su Zheng, Xiaoxiao Liang, Yuzhe Ma, Bei Yu, “Coordinated Clip-Wise Gradient Scheduling for Full-Chip ILT via Policy Learning”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C349] Fangzhou Liu, Wuqian Tang, Bo-Ying Wang, An-Chieh Shen, Han-Wen Tsao, Yuyang Ye, Yun Shao, Chun-Yao Wang, Bei Yu, “HyPAS: A Hybrid Optimization Framework for Placement and Sizing Co-Optimization”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C348] Hongquan He, Ziyang Yu, Jiaqi Liu, Bei Yu, Jingyi Yu, Hao Geng, “CPW-SMO: Generating Mask Sets and Common Source for Maximum Common Process Window”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C347] Yuhao Ji, Yunqi Shi, Tianshu Hou, Yuxuan Zhao, Chunyuan Zhao, Peiyu Liao, Zizheng Guo, Chao Qian, Yibo Lin, Bei Yu, “Integrated Timing-driven Placement for Hybrid-Bonding-based Face-to-Face 3D ICs”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C346] Su Zheng, Xinyun Zhang, Bei Yu, Martin Wong, “DR. OPC: Differentiable Rasterization for Advanced Optical Proximity Correction”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C345] Haoyang Xu, Zheng Yang, Zhen Zhuang, Leilei Jin, Bei Yu, Sung Kyu Lim, Tsung-Yi Ho, “RTL-3D: Timing-aware Tier Partitioning for 3D ICs Using Pre-synthesis Timing Analysis”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C344] Peng Xu, Mingzi Wang, Yapeng Li, Yuyang Ye, Tinghuan Chen, Tsung-Yi Ho, Bei Yu, “DiffSP: Differentiable Sequence Pair-based Analog Placement”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C343] Shanyi Li, Leilei Jin, Siyuan Liang, Zhen Zhuang, Rongmei Chen, Bei Yu, Tsung-Yi Ho, “FlexiCTS: CPPR-Aware 3D Clock Tree Synthesis for Face-to-Face Bonded ICs”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C342] Leilei Jin, Haoyang Xu, Siyuan Liang, Zhen Zhuang, Zhou Hu, Zixiao Wang, Bei Yu, Rongmei Chen, Tsung-Yi Ho, “BSPDN-Elite: A Comprehensive Framework for Optimizing Timing, Power and Routing Resources in BSPDN Designs”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C341] Yaohui Han, Beichen Li, Mingyang Zhao, Rongliang Fu, Qunsong Ye, Tinghuan Chen, Bei Yu, Tsung-Yi Ho, “ModuPlace: LLM-Assisted Modular PCB Placement via Preference-Optimized Constraint Graph Generation”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

  • [C334] Wendong Xu, Jing Xiong, Chenyang Zhao, Qiujiang Chen, Haoran Wang, Hui Shen, Zhongwei Wan, Jianbo Dai, Taiqiang Wu, He Xiao, Chaofan Tao, Zhuoqing Mao, Ying Sheng, Zhijiang Guo, Hongxia Yang, Bei Yu, Lingpeng Kong, Quanquan Gu, Ngai Wong, “SwingArena: Adversarial Programming Arena for Long-context GitHub Issue Solving”, International Conference on Learning Representations (ICLR), Rio de Janeiro, Brazil, Apr. 23–27, 2026. (paper) (Oral)

  • [C323] Yaohui Han, Beichen Li, Rongliang Fu, Qunsong Ye, Zhiyuan Lu, Junchen Liu, Bei Yu, Tsung-Yi Ho, Tinghuan Chen, “PCB-Migrator: Automated PCB PnR Migration”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (slides)

  • [C307] Shuo Ren, Zhen Zhuang, Rongliang Fu, Leilei Jin, Libo Shen, Bei Yu, Tsung-Yi Ho, “Partitioning-free 3D-IC Floorplanning”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Hong Kong, Jan. 19–22, 2026. (paper) (slides)


  • [J190] Jiequan Cui, Beier Zhu, Qingshan Xu, Zhuotao Tian, Xiaojuan Qi, Bei Yu, Hanwang Zhang, Richang Hong, “Generalized Kullback-Leibler Divergence Loss”, IEEE Transactions on Pattern Analysis and Machine Intelligence (TPAMI), vol. 48, no. 10, pp. 13149–13161, 2026. (paper)

  • [J184] Guojin Chen, Peng Xu, Hongquan He, Hao Geng, Bei Yu, “Efficient Bilevel Source Mask Optimization”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 45, no. 09, pp. 4124–4135, 2026. (paper)

  • [J166] Hongduo Liu, Siting Liu, Zhongdong Qi, Tsung-Yi Ho, Bei Yu, “Selecting Nets to Rip Up and Reroute via SAT”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 45, no. 05, pp. 2136–2140, 2026. (paper)

  • [J156] Shanyi Li, Zhen Zhuang, Mingyu Liu, Weihua Sheng, Bei Yu, Tsung-Yi Ho, “HiePlace: Efficient Hierarchical PCB Placement”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 45, no. 01, pp. 428–440, 2026. (paper)

2025

  • [C281] Shuo Yin, Su Zheng, Ziyang Yu, Bei Yu, “TorchLitho 2.0: Ultrafast Differentiable Lithography Simulation Engine”, IEEE International Conference on ASIC (ASICON), Kunming, Oct. 21–24, 2025. (paper) (slides) (code) (Invited Paper)

  • [C280] Ziyang Yu, Bei Yu, “Large-Scale VLSI Mask Optimization: A Survey”, International Workshop on Advanced Patterning Solutions (IWAPS), Shenzhen, Oct. 14–15, 2025. (paper) (slides) (Keynote Paper)

  • [C274] Shaoteng Liu, Tianyu Wang, Jui-Hsien Wang, Qing Liu, Zhifei Zhang, Joon-Young Lee, Yijun Li, Bei Yu, Zhe Lin, Soo Ye Kim, Jiaya Jia, “Generative Video Propagation”, IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), Nashville, Jun. 11–15, 2025. (video) (paper)

  • [C273] Bin Xia, Yuechen Zhang, Jingyao Li, Chengyao Wang, Yitong Wang, Xinglong Wu, Bei Yu, Jiaya Jia, “DreamOmni: Unified Image Generation and Editing”, IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), Nashville, Jun. 11–15, 2025. (paper)

  • [C259] Haisheng Zheng, Haoyuan WU, Zhuolun He, Yuzhe Ma, Bei Yu, “iRw: An Intelligent Rewriting”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Lyon, France, Mar. 31–Apr. 02, 2025. (paper) (slides) (poster)


  • [J137] Yuan Pu, Tinghuan Chen, Zhuolun He, Jiajun Qin, Chen Bai, Haisheng Zheng, Yibo Lin, Bei Yu, “IncreMacro: Incremental Macro Placement Refinement”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 44, no. 08, pp. 3222–3235, 2025. (paper)

  • [J124] Hongduo Liu, Peiyu Liao, Mengchuan Zou, Bowen Pang, Xijun Li, Mingxuan Yuan, Tsung-Yi Ho, Bei Yu, “Layout Decomposition via Boolean Satisfiability”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 44, no. 03, pp. 1112–1125, 2025. (paper)

2024

  • [C240] Guojin Chen, Haoyu Yang, Haoxing Ren, Bei Yu and David Z. Pan, “Differentiable Edge-based OPC”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), New Jersey, Oct. 27–31, 2024. (paper) (slides)

  • [C197] Yu Zhang, Wei Lin, Sisi Chen, Qingyu Song, Jiaxun Lu, Yunfeng Shao, Bei Yu, Hong Xu, “Fed2Com: Towards Efficient Compression in Federated Learning”, IEEE International Conference on Computing, Networking and Communications (ICNC), Hawaii, Feb. 19–22, 2024.

  • [C196] Xingquan Li, Zengrong Huang, Simin Tao, Zhipeng Huang, Chunan Zhuang, Hao Wang, Yifan Li, Yihang Qiu, Guojie Luo, Huawei Li, Haihua Shen, Mingyu Chen, Dongbo Bu, Wenxing Zhu, Ye Cai, Xiaoming Xiong, Ying Jiang, Yi Heng, Peng Zhang, Bei Yu, Biwei Xie, Yungang Bao, “iEDA: An Open-source infrastructure of EDA”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024. (paper) (slides) (Invited Paper)

  • [C195] Xingquan Li, Simin Tao, Shijian Chen, Zhisheng Zeng, Zhipeng Huang, Hongxi Wu, Weiguo Li1, Zengrong Huang, Liwei Ni, Xueyan Zhao, He Liu, Shuaiying Long, Ruizhi Liu, Xiaoze Lin, Bo Yang, Fuxing Huang, Zonglin Yang, Yihang Qiu, Zheqing Shao, Jikang Liu, Yuyao Liang, Biwei Xie, Yungang Bao, Bei Yu, “iPD: An Open-source intelligent Physical Design Tool Chain”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024. (paper) (slides) (Invited Paper)


  • [J117] Jiequan Cui, Zhisheng Zhong, Zhuotao Tian, Shu Liu, Bei Yu, Jiaya Jia, “Generalized Parametric Contrastive Learning”, IEEE Transactions on Pattern Analysis and Machine Intelligence (TPAMI), vol. 46, no. 12, pp. 7463–7474, 2024. (paper)

2023

  • [C179] Su Zheng, Bei Yu, Martin Wong, “OpenILT: An Open Source Inverse Lithography Technique Framework”, IEEE International Conference on ASIC (ASICON), Nanjing, Oct. 24–27, 2023. (paper) (slides) (Invited Paper)


2022


  • [J71] Martin Rapp, Hussam Amrouch, Yibo Lin, Bei Yu, David Z. Pan, Marilyn Wolf, Jorg Henkel, “MLCAD: A Survey of Research in Machine Learning for CAD”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 10, pp. 3162–3181, 2022. (paper) (Keynote Paper)

  • [J64] Yibo Lin, Xiaohan Gao, Tinghuan Chen, Bei Yu, “Machine learning for digital circuit backend design”, Micro/nano Electronics and Intelligent Manufacturing, vol. 2, no. 3, 2022. (in Chinese) (paper)

  • [J61] Ran Chen, Wei Zhong, Haoyu Yang, Hao Geng, Fan Yang, Xuan Zeng, Bei Yu, “Faster Region-based Hotspot Detection”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 3, pp. 669–680, 2022. (code) (paper)

2021

  • [C118] Tinghuan Chen, Qi Sun, Bei Yu, “Machine Learning in Nanometer AMS Design for Reliability”, IEEE International Conference on ASIC (ASICON), Kunming, China, Oct. 26–29, 2021. (paper) (slides) (Invited Paper)

  • [C116] Wei Li, Guojin Chen, Haoyu Yang, Ran Chen, Bei Yu, “Learning Point Clouds in EDA”, ACM International Symposium on Physical Design (ISPD), Mar. 21–Mar. 24, 2021. (paper) (slides) (Invited Paper)

  • [C111] Hongjia Li, Mengshu Sun, Tianyun Zhang, Olivia Chen, Nobuyuki Yoshikawa, Bei Yu, Yanzhi Wang, Yibo Lin, “Towards AQFP-Capable Physical Design Automation”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Feb. 01–05, 2021. (paper)


  • [J58] Wei Li, Yuzhe Ma, Qi Sun, Lu Zhang, Yibo Lin, Iris Hui-Ru Jiang, Bei Yu, David Z. Pan, “OpenMPL: An Open Source Layout Decomposer”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 40, no. 11, pp. 2331–2344, 2021. (paper)

  • [J56] Guyue Huang, Jingbo Hu, Yifan He, Jialong Liu, Mingyuan Ma, Zhaoyang Shen, Juejian Wu, Yuanfan Xu, Hengrui Zhang, Kai Zhong, Xuefei Ning, Yuzhe Ma, Haoyu Yang, Bei Yu, Huazhong Yang, Yu Wang, “Machine Learning for Electronic Design Automation: A Survey”, ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 25, no. 5, 2021. (paper)

2020


2019

  • [C80] Bentian Jiang, Xiaopeng Zhang, Ran Chen, Gengjie Chen, Peishan Tu, Wei Li, Evangeline F. Y. Young, Bei Yu, “FIT: Fill Insertion Considering Timing”, ACM/IEEE Design Automation Conference (DAC), pp. 221:1–221:6, Las Vegas, NV, June 2–6, 2019. (paper) (slides) (poster)


2018


2017

  • [C57] Hang Zhang, Fengyuan Zhu, Haocheng Li, Evangeline F. Y. Young, Bei Yu, “Bilinear Lithography Hotspot Detection”, ACM International Symposium on Physical Design (ISPD), pp. 7–14, Portland, OR, Mar. 19–22, 2017. (paper) (Best Paper Award)


2016


2015


2014

2013


2012

  • [C13] Bei Yu, Jhih-Rong Gao, Duo Ding, Yongchan Ban, Jae-Seok Yang, Kun Yuan, Minsik Cho, David Z. Pan, “Dealing with IC Manufacturability in Extreme Scaling”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), pp. 240–242, San Jose, Nov. 5–8, 2012. (paper) (Embedded Tutorial paper)


2011

2010

2009



Books / Book Chapters

 

[B4] Haoyu Yang, Yibo Lin, Bei Yu, “Machine Learning for Mask Synthesis and Verification”, in Machine Learning Applications in Electronic Design Automation, Mark Ren eds., Springer, 2022. (paper)

 

[B3] Shiyan Hu, Bei Yu, “Big Data Analytics for Cyber-Physical Systems”, Springer, 2020.

 

[B2] Bei Yu, David Z. Pan, “Design for Manufacturability with Advanced Lithography”, Springer, 2016.

 

[B1] Bei Yu, David Z. Pan, “Layout Decomposition for Triple Patterning”, in Encyclopedia of Algorithms, M.-Y. Kao eds., Springer, 2015. (paper)


Dissertation

Newsletters

  • [N2] Bei Yu, Gilda Garreton, David Z. Pan, “Layout Compliance for Triple Patterning Lithography: An Iterative Approach”, SPIE Newsroom.