Publications

Summary: IEEE TCAD (60), DAC (36), ICCAD (41), etc.

Journal & Conference Papers

Accepted

  • [J104] Zhaoting Chen, Junzhe Cai, Changhao Yan, Zhaori Bi, Yuzhe Ma, Bei Yu, Dian Zhou, Xuan Zeng, “pNeurFill: Enhanced Neural Network Model-Based Dummy Filling Synthesis with Perimeter Adjustment”, accepted by IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).

  • [J103] Binwu Zhu, Su Zheng, Ziyang Yu, Guojin Chen, Yuzhe Ma, Fan Yang, Bei Yu, Martin Wong, “L2O-ILT: Learning to Optimize Inverse Lithography Techniques”, accepted by IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).

2024

  • [C192] Shixin Chen, Su Zheng, Chen Bai, Wenqian Zhao, Shuo Yin, Yang Bai, Bei Yu, “SoC-Tuner: An Importance-guided Exploration Framework for DNN-targeting SoC Design”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024.

  • [C191] Haisheng Zheng, Zhuolun He, Fangzhou Liu, Zehua Pei, Bei Yu, “LSTP: A Logic Synthesis Timing Predictor”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024.

  • [C190] Ping Zhang, Pengju Yao, Xingquan Li, Bei Yu, Wenxing Zhu, “V-GR: 3D Global Routing with Via Minimization and Multi-Strategy Rip-up and Rerouting”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024.

2023

  • [C189] Su Zheng, Haoyu Yang, Binwu Zhu, Bei Yu, Martin D.F. Wong, “LithoBench: Benchmarking AI Computational Lithography for Semiconductor Manufacturing”, Neural Information Processing Systems (NeurIPS), New Orleans, Dec. 10–16, 2023.

  • [C188] Zhuolun He, Bei Yu, “Heterogenous Acceleration for Design Rule Checking”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Francisco, Oct. 29–Nov. 02, 2023. (Invited Paper)

  • [C187] Chen Bai, Xuechao Wei, Youwei Zhuo, Yi Cai, Hongzhong Zheng, Bei Yu, Yuan Xie, “Klotski: DNN Model Orchestration Framework for Dataflow Architecture Accelerators”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Francisco, Oct. 29–Nov. 02, 2023.

  • [C186] Ziyang Yu, Chen BAI, Shoubo Hu, Ran Chen, Taohai He, Mingxuan Yuan, Bei Yu, Martin Wong, “IT-DSE: Invariant Risk Minimized Transfer Microarchitecture Design Space Exploration”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Francisco, Oct. 29–Nov. 02, 2023.

  • [C185] Su Zheng, Lancheng Zou, Peng XU, Siting Liu, Bei Yu, Martin Wong, “Lay-Net: Grafting Netlist Knowledge on Layout-Based Congestion Prediction”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Francisco, Oct. 29–Nov. 02, 2023.

  • [C184] Zehua Pei, Fangzhou Liu, Zhuolun He, Guojin Chen, Haisheng Zheng, Keren Zhu, Bei Yu, “AlphaSyn: Logic Synthesis Optimization with Efficient Monte Carlo Tree Search”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Francisco, Oct. 29–Nov. 02, 2023.

  • [C183] Rongliang Fu, Olivia Chen, Junying Huang, Bei Yu, Nobuyuki Yoshikawa, Tsung-Yi Ho, “DLPlace: A Delay-Line Clocking-based Placement Framework for AQFP Circuits”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Francisco, Oct. 29–Nov. 02, 2023.

  • [C182] Zhen Zhuang, Kai-Yuan Chao, Bei Yu, Tsung-Yi Ho and Martin Wong, “Multi-Product Optimization for 3D Heterogeneous Integration with D2W Bonding”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Francisco, Oct. 29–Nov. 02, 2023.

  • [C181] Fuxing Huang, Duanxiang Liu, Xingquan Li, Bei Yu, Wenxing Zhu, “Handling Orientation and Aspect Ratio of Modules in Electrostatics-based Large Scale Fixed-Outline Floorplanning”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Francisco, Oct. 29–Nov. 02, 2023.

  • [C180] Chen Bai, Jiayi Huang, Xuechao Wei, Yuzhe Ma, Sicheng Li, Hongzhong Zheng, Bei Yu, Yuan Xie, “ArchExplorer: Microarchitecture Exploration Via Bottleneck Analysis”, IEEE/ACM International Symposium on Microarchitecture (MICRO), Toronto, Oct. 28–Nov. 01, 2023.

  • [C179] Su Zheng, Bei Yu, Martin Wong, “OpenILT: An Open Source Inverse Lithography Technique Framework”, IEEE International Conference on ASIC (ASICON), Nanjing, Oct. 24–27, 2023. (paper) (Invited Paper)

  • [C178] Wanli Chen, Xufeng Yao, Xinyun Zhang, Bei Yu, “Efficient Deep Space Filling Curve”, IEEE International Conference on Computer Vision (ICCV), Paris, Oct. 02–06, 2023.

  • [C177] Zhuolun He, Haoyuan Wu, Xinyun Zhang, Xufeng Yao, Su Zheng, Haisheng Zheng and Bei Yu, “ChatEDA: A Large Language Model Powered Autonomous Agent for EDA”, ACM/IEEE Workshop on Machine Learning for CAD (MLCAD), Utah, Sep. 11-13, 2023. (paper) (arXiv)

  • [C176] Bei Yu, “Machine Learning in EDA: When and How”, ACM/IEEE Workshop on Machine Learning for CAD (MLCAD), Utah, Sep. 11-13, 2023. (paper) (Plenary Talk)

  • [C174] Shui Jiang, Tsung-Wei Huang, Bei Yu, Tsung-Yi Ho, “SNICIT: Accelerating Sparse Neural Network Inference via Compression at Inference Time on GPU”, International Conference on Parallel Processing (ICPP), Utah, Aug. 07–10, 2023. (paper)


2022


  • [J71] Martin Rapp, Hussam Amrouch, Yibo Lin, Bei Yu, David Z. Pan, Marilyn Wolf, Jorg Henkel, “MLCAD: A Survey of Research in Machine Learning for CAD”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 10, pp. 3162–3181, 2022. (paper) (Keynote Paper)

  • [J64] Yibo Lin, Xiaohan Gao, Tinghuan Chen, Bei Yu, “Machine learning for digital circuit backend design”, Micro/nano Electronics and Intelligent Manufacturing, vol. 2, no. 3, 2022. (in Chinese) (paper)

  • [J61] Ran Chen, Wei Zhong, Haoyu Yang, Hao Geng, Fan Yang, Xuan Zeng, Bei Yu, “Faster Region-based Hotspot Detection”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 3, pp. 669–680, 2022. (code) (paper)

2021

  • [C118] Tinghuan Chen, Qi Sun, Bei Yu, “Machine Learning in Nanometer AMS Design for Reliability”, IEEE International Conference on ASIC (ASICON), Kunming, China, Oct. 26–29, 2021. (paper) (slides) (Invited Paper)

  • [C116] Wei Li, Guojin Chen, Haoyu Yang, Ran Chen, Bei Yu, “Learning Point Clouds in EDA”, ACM International Symposium on Physical Design (ISPD), Mar. 21–Mar. 24, 2021. (paper) (slides) (Invited Paper)

  • [C111] Hongjia Li, Mengshu Sun, Tianyun Zhang, Olivia Chen, Nobuyuki Yoshikawa, Bei Yu, Yanzhi Wang, Yibo Lin, “Towards AQFP-Capable Physical Design Automation”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Feb. 01–05, 2021. (paper)


  • [J58] Wei Li, Yuzhe Ma, Qi Sun, Lu Zhang, Yibo Lin, Iris Hui-Ru Jiang, Bei Yu, David Z. Pan, “OpenMPL: An Open Source Layout Decomposer”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 40, no. 11, pp. 2331–2344, 2021. (paper)

  • [J56] Guyue Huang, Jingbo Hu, Yifan He, Jialong Liu, Mingyuan Ma, Zhaoyang Shen, Juejian Wu, Yuanfan Xu, Hengrui Zhang, Kai Zhong, Xuefei Ning, Yuzhe Ma, Haoyu Yang, Bei Yu, Huazhong Yang, Yu Wang, “Machine Learning for Electronic Design Automation: A Survey”, ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 25, no. 5, 2021. (paper)

2020


2019

  • [C80] Bentian Jiang, Xiaopeng Zhang, Ran Chen, Gengjie Chen, Peishan Tu, Wei Li, Evangeline F. Y. Young, Bei Yu, “FIT: Fill Insertion Considering Timing”, ACM/IEEE Design Automation Conference (DAC), pp. 221:1–221:6, Las Vegas, NV, June 2–6, 2019. (paper) (slides) (poster)


2018


2017

  • [C57] Hang Zhang, Fengyuan Zhu, Haocheng Li, Evangeline F. Y. Young, Bei Yu, “Bilinear Lithography Hotspot Detection”, ACM International Symposium on Physical Design (ISPD), pp. 7–14, Portland, OR, Mar. 19–22, 2017. (paper) (Best Paper Award)


2016


2015


2014

2013


2012

  • [C13] Bei Yu, Jhih-Rong Gao, Duo Ding, Yongchan Ban, Jae-Seok Yang, Kun Yuan, Minsik Cho, David Z. Pan, “Dealing with IC Manufacturability in Extreme Scaling”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), pp. 240–242, San Jose, Nov. 5–8, 2012. (paper) (Embedded Tutorial paper)


2011

2010

2009



Books / Book Chapters

 

[B4] Haoyu Yang, Yibo Lin, Bei Yu, “Machine Learning for Mask Synthesis and Verification”, in Machine Learning Applications in Electronic Design Automation, Mark Ren eds., Springer, 2022. (paper)

 

[B3] Shiyan Hu, Bei Yu, “Big Data Analytics for Cyber-Physical Systems”, Springer, 2020.

 

[B2] Bei Yu, David Z. Pan, “Design for Manufacturability with Advanced Lithography”, Springer, 2016.

 

[B1] Bei Yu, David Z. Pan, “Layout Decomposition for Triple Patterning”, in Encyclopedia of Algorithms, M.-Y. Kao eds., Springer, 2015. (paper)


Dissertation

Newsletters

  • [N2] Bei Yu, Gilda Garreton, David Z. Pan, “Layout Compliance for Triple Patterning Lithography: An Iterative Approach”, SPIE Newsroom.