Publications

Summary: TCAD (101), DAC (62), ICCAD (64), etc.

Journal & Conference Papers

Selected Preprints

  • “DreamOmni2: Multimodal Instruction-based Editing and Generation”. (arXix) (Github) (media)

  • “MGM-Omni: Scaling Omni LLMs to Personalized Long-Horizon Speech”. (arXiv) (Github)

  • “Grove MoE: Towards Efficient and Superior MoE LLMs with Adjugate Experts”. (arXiv)

  • “DiLA: Enhancing LLM Tool Learning with Differential Logic Layer”. (arXiv)

  • “On the Evaluation of Generative Models in Distributed Learning Tasks”. (arXiv)

  • “Generative Distribution Distillation”. (arXiv)

Accepted

  • [J169] Xiaogang Xu, Yitong Yu, Nianjuan Jiang, Jiafei Wu, Bei Yu, Jiangbo Lu, Jiaya Jia, “PVDD: A Practical Benchmark Dataset and Network for Video Denoising”, accepted by Frontiers of Computer Science.

  • [J159] Shanyi Li, Zhen Zhuang, Mingyu Liu, Weihua Sheng, Bei Yu, Tsung-Yi Ho, “HiePlace: Efficient Hierarchical PCB Placement”, accepted by IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).

2026

  • [C334] Yuyang Ye, Che-Kuan Shen, Xiangfei Hu, Yuchen Liu, Shuo Yin, Xufeng Yao, Tsung-Yi Ho, Bei Yu, “LongRTL: Graph-Similarity-Guided LLM-driven Long Context RTL Optimization”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C333] Siting Liu, Peng Xu, Peiyu Liao, Keren Zhu, Yibo Lin, Bei Yu, “Submodular Maximization-inspired Adaptive Routing Bend Space Planning”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C332] Zixiao Wang, Tianshu Hou, Chenghan Wang, Zhen Zhuang, Tsung-Yi Ho, Farzan Farnia, Bei Yu, “FastRW: An Efficient Random Walk Method for Steady-State Thermal Analysis”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C331] Zixiao Wang, Jieya Zhou, Xinyun Zhang, Shoubo Hu, Farzan Farnia, Bei Yu, “DiffResist: Physics-Constrained Diffusion for Photoresist Modeling”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C330] Peng Xu, Ziyang Yu, Yuan Pu, Xinyun Zhang, Donger Luo, Hao Geng, Siyuan Xu, Tsung-Yi Ho, Bei Yu, “RATuner: Retrieval-Augmented VLSI Flow Design Parameter Tuning Framework”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C329] Su Zheng, Ziyang Yu, Bei Yu, Martin Wong, “Scalable Second-Order Optimizer for Full-Chip Inverse Lithography Techniques”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C328] Shixin Chen, Peng Xu, Yapeng Li, Tinghuan Chen, Bei Yu, “IP-Matcher: An Efficient One-to-Many Matching Framework for Analog Circuit Design and Reusing”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C327] Lancheng Zou, Sing Sen YE, Shuo Yin, Yuan Pu, Jiaxi Jiang, Siting Liu, Yuxuan Zhao, Bei Yu, “IncreMacro-3D: Incremental Macro Placement for Face-to-Face Stacked Memory-on-Logic 3D ICs”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C326] Wendong Xu, Chujie Chen, He Xiao, Kuan Li, Jing Xiong, Chen Zhang, Wenyong Zhou, Chaofan Tao, Yang Bai, Bei Yu, Ngai Wong, “AnchorTP: Resilient LLM Inference with State-Preserving Elastic Tensor Parallelism”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C325] Mengjia Dai, Hongduo Liu, Yuhao Ji, Xiaojing Su, Yibo Lin, Bei Yu, “Soft-Constrained Triple Patterning Layout Decomposition”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C324] Jiajun Qin, Cheng Tan, Ruihong Yin, Tianhua Xia, Sai Qian Zhang, Bei Yu, “FLAME: A Framework Exploring Execution Strategies for Multi-Cycle Operations in CGRA”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C323] Rongliang Fu, Wei Xuan, Shuo Yin, Guangyu Hu, Chen Chen, Hongce Zhang, Bei Yu, Tsung-Yi Ho, “eLogic: A E-Graph-based Logic Rewriting Framework for Majority-Inverter Graphs”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C322] Yaohui Han, Beichen Li, Rongliang Fu, Qunsong Ye, Zhiyuan Lu, Junchen Liu, Bei Yu, Tsung-Yi Ho, Tinghuan Chen, “PCB-Migrator: Automated PCB PnR Migration”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C321] Zhenghao Chen, Yuan Pu, Hairuo Han, Yuntao Nie, Jiajun Qin, Yuhan Qin, Tairu Qiu, Zhuolun He, Jianwang Zhai, Bei Yu, Kang Zhao, “MAEDA: An LLM-Powered Multi-Agent Evaluation Framework for EDA Tool Documentation QA”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C320] Wenbo Xu, Silin Chen, Yibo Huang, Xinyun Zhang, Zixiao WANG, Bei Yu, Ningmu Zou, “Node2Node: Node Adaptation with Transformer for Cross-Node Hotspot Detection”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C319] Zhiteng Chao, Yonghao Wang, Xinyu Zhang, Jiaxin Zhou, Tenghui Hua, Husheng Han, Tianmeng Yang, Jianan Mu, Bei Yu, Rui Zhang, Jing Ye, Huawei Li, “Think with Self-Decoupling and Self-Verification: Automated RTL Design with Backtrack-ToT”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C318] Zhaohai Di, Jindong Tu, Zhiyuan HE, Yuan Pu, Jiawei Liu, Chong Tong, Tsung-Yi Ho, Bei Yu, Tinghuan Chen, “Smart-PCLib: A LLM-based Multi-Agent Framework for Automated PCB Component Library Generation”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C317] Xinheng Li, Donger Luo, Peng Xu, Ziyang Yu, Qi Sun, Tinghuan Chen, Bei Yu, Hao Geng, “EDA Flow Matters: Stage-Aware Parameter Optimization of Tool Chain”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C316] Qinggong Shen, Chaoli Zhang, Haoyang Xu, Zhiwen Yu, Bin Guo, Yuxuan Zhao, Bei Yu, Tsung-Yi Ho, Xing Huang, “HPPlacer: A High-Precision Slack-Aware Global Placement Engine”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C315] Bohao Li, Ranran Liu, Yumeng Liu, Cong Jiang, Kang Liu, Bei Yu, Kun Ren, Qi Sun, Cheng Zhuo, “Lithography Hotspot Detection for Complex Non-Manhattan Layouts via Graph Neural Network”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026.

  • [C314] Shixin Chen, Hengyuan Zhang, Jianwang Zhai, Bei Yu, “CHASE: A CHiplet Architecture Simulation and Exploration Framework with Decoupled Multi-Fidelity Optimization”, ACM International Symposium on Physical Design (ISPD), Bonn, Mar. 15–18, 2026.

  • [C313] Peng Xu, Yapeng Li, Tinghuan Chen, Tsung-Yi Ho, Bei Yu, “KCLNet: Electrically Equivalence-Oriented Graph Representation Learning for Analog Circuits”, AAAI Conference on Artificial Intelligence (AAAI), Singapore, Feb. 20–27, 2026. (Oral)

  • [C312] Hongduo Liu, Yuntao Lu, Mingjun Wang, Xufeng Yao, Bei Yu, “LLM-Assisted Circuit Verification: A Comprehensive Survey”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Hong Kong, Jan. 19–22, 2026. (Invited Paper)

  • [C311] Ziyang Yu, Peng Xu, Su Zheng, Siyuan Xu, Hao Geng, Bei Yu, Martin D.F. Wong, “CausalTuner: Will Causality Help High-Dimensional EDA Tool Parameter Tuning”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Hong Kong, Jan. 19–22, 2026.

  • [C310] Xinyun Zhang, Zixiao Wang, Yurui Kuang, Bei Yu, “Video-based Visible-Event Cross-modal Person Re-identification for Edge AI Surveillance Systems”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Hong Kong, Jan. 19–22, 2026.

  • [C309] Zhen Zhuang, Zheng Yang, Yuxuan Zhao, Jiawei Hu, Bei Yu, Sung Kyu Lim, Tsung-Yi Ho, “DPO-3D: Differentiable Power Delivery Network Optimization via Flexible Modeling for Routability and IR-Drop Tradeoff in Face-to-Face 3D ICs”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Hong Kong, Jan. 19–22, 2026.

  • [C308] Rongliang Fu, Libo Shen, Ziyi Wang, Zhengxing Lei, Zixiao Wang, Junying Huang, Bei Yu, Tsung-Yi Ho, “DCLOG: Don't Cares-based Logic Optimization using Pre-training Graph Neural Networks”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Hong Kong, Jan. 19–22, 2026.

  • [C307] Shuo Ren, Zhen Zhuang, Rongliang Fu, Leilei Jin, Libo Shen, Bei Yu, Tsung-Yi Ho, “Partitioning-free 3D-IC Floorplanning”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Hong Kong, Jan. 19–22, 2026.

  • [C306] Xiaoxiao Liang, Yang Luo, Bei Yu, Yuzhe Ma, “BEAM: Bidirectional MEEF-Driven Mask Optimization for Curvilinear Photonic Design”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Hong Kong, Jan. 19–22, 2026.

  • [C305] Haisheng Zheng, Zhuolun He, Shuo Yin, Yuzhe Ma, Bei Yu, “CombRewriter: Enabling Combinational Logic Simplification in MLIR-Based Hardware Compiler”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Hong Kong, Jan. 19–22, 2026.

2025

  • [C297] Yuxuan Zhao, Feng Gu, Siting Liu, Peiyu Liao, Bei Yu, “H3D: Heterogeneous Resources Aware Global Router for Face-to-Face Bonded 3D ICs”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025. (paper) (slides)

  • [C296] Ziyi Wang, Fangzhou Liu, Tsung-Yi Ho, David Z. Pan, Bei Yu, “NUA-Timer: Pre-Synthesis Timing Prediction Under Non-Uniform Input Arrival Times”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025. (paper) (slides)

  • [C295] Shuo Yin, Jiahao Xu, Jiaxi Jiang, Mingjun Li, Yuzhe Ma, Tsung-Yi Ho, Bei Yu, “G-Contour: GPU Accelerated Contour Tracing For Large-Scale Layouts”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025. (paper) (slides)

  • [C294] Yuntao Lu, Mingjun Wang, Yihan Wen, Boyu Han, Jianan Mu, Huawei Li, Bei Yu, “VIRTUAL: Vector-based Dynamic Power Estimation via Decoupled Multi-Modality Learning”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025. (paper) (slides)

  • [C293] Yuan Pu, Yuhao Ji, Siying Yu, Zuodong Zhang, Zizheng Guo, Zhuolun He, Yibo Lin, David Z. Pan, Bei Yu, “GPU Acceleration for Versatile Buffer Insertion”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025. (paper) (slides)

  • [C292] Yuan Pu, Zhuolun He, Shutong Lin, Jiajun Qin, Xinyun Zhang, Hairuo Han, Haisheng Zheng, Yuqi Jiang, Cheng Zhuo, Qi Sun, David Z. Pan, Bei Yu, “MM-GRADE: A Multi-Modal EDA Tool Documentation QA Framework Leveraging Retrieval Augmented Generation”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025. (paper) (slides)

  • [C291] Yuhao Ji, Yuntao Lu, Zuodong Zhang, Zizheng Guo, Yibo Lin, Bei Yu, “DiffCCD: Differentiable Concurrent Clock and Data Optimization”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025. (paper) (slides)

  • [C290] Peiyu Liao, Yuxuan Zhao, Siting Liu, Bei Yu, “Ultrafast Density Gradient Accumulation in 3D Analytical Placement with Divergence Theorem”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025. (paper) (slides)

  • [C289] Shanyi Li, Zhen Zhuang, Siyuan Liang, Bei Yu, Tsung-Yi Ho, “MMPack: Multi-Mask Co-Design for Ultra-Large Wafer-Scale Package Integration”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025. (paper)

  • [C288] Leilei Jin, Rongliang Fu, Zhen Zhuang, Liang Xiao, Fangzhou Liu, Bei Yu, Tsung-Yi Ho, “ChronoTE: Crosstalk-Aware Timing Estimation for Routing Optimization via Edge-Enhanced GNNs”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025. (paper)

  • [C287] Jindong Tu, Yapeng Li, Peng Xu, Tuo Li, Guoqing Li, Zushuai Xie, Bei Yu, Tinghuan Chen, “RSizing: Robust Bayesian Optimization for Analog Circuit Sizing Under Process Variations”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025. (paper)

  • [C286] Zhen Wang, Hongquan He, Tao Wu, Xuming He, Qi Sun, Cheng Zhuo, Bei Yu, Jingyi Yu, Hao Geng, “LMLitho: A Large Vision Model-Driven Lithography Simulation Framework”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025. (paper) (Best Paper Award Nomination)

  • [C285] Donger Luo, Tianyi Li, Xinheng Li, Qi Sun, Cheng Zhuo, Bei Yu, Jingyi Yu, Hao Geng, “LLM-Augmented Multi-Modal Fusion for SoC Design Space Exploration”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025. (paper)

  • [C281] Shuo Yin, Su Zheng, Ziyang Yu, Bei Yu, “TorchLitho 2.0: Ultrafast Differentiable Lithography Simulation Engine”, IEEE International Conference on ASIC (ASICON), Kunming, Oct. 21–24, 2025. (paper) (slides) (code) (Invited Paper)

  • [C280] Ziyang Yu, Bei Yu, “Large-Scale VLSI Mask Optimization: A Survey”, International Workshop on Advanced Patterning Solutions (IWAPS), Shenzhen, Oct. 14–15, 2025. (paper) (slides) (Keynote Paper)

  • [C274] Shaoteng Liu, Tianyu Wang, Jui-Hsien Wang, Qing Liu, Zhifei Zhang, Joon-Young Lee, Yijun Li, Bei Yu, Zhe Lin, Soo Ye Kim, Jiaya Jia, “Generative Video Propagation”, IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), Nashville, Jun. 11–15, 2025. (video) (paper)

  • [C273] Bin Xia, Yuechen Zhang, Jingyao Li, Chengyao Wang, Yitong Wang, Xinglong Wu, Bei Yu, Jiaya Jia, “DreamOmni: Unified Image Generation and Editing”, IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), Nashville, Jun. 11–15, 2025. (paper)

  • [C259] Haisheng Zheng, Haoyuan WU, Zhuolun He, Yuzhe Ma, Bei Yu, “iRw: An Intelligent Rewriting”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Lyon, France, Mar. 31–Apr. 02, 2025. (paper) (slides) (poster)


  • [J137] Yuan Pu, Tinghuan Chen, Zhuolun He, Jiajun Qin, Chen Bai, Haisheng Zheng, Yibo Lin, Bei Yu, “IncreMacro: Incremental Macro Placement Refinement”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 44, no. 08, pp. 3222–3235, 2025. (paper)

  • [J124] Hongduo Liu, Peiyu Liao, Mengchuan Zou, Bowen Pang, Xijun Li, Mingxuan Yuan, Tsung-Yi Ho, Bei Yu, “Layout Decomposition via Boolean Satisfiability”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 44, no. 03, pp. 1112–1125, 2025. (paper)

2024

  • [C240] Guojin Chen, Haoyu Yang, Haoxing Ren, Bei Yu and David Z. Pan, “Differentiable Edge-based OPC”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), New Jersey, Oct. 27–31, 2024. (paper) (slides)

  • [C197] Yu Zhang, Wei Lin, Sisi Chen, Qingyu Song, Jiaxun Lu, Yunfeng Shao, Bei Yu, Hong Xu, “Fed2Com: Towards Efficient Compression in Federated Learning”, IEEE International Conference on Computing, Networking and Communications (ICNC), Hawaii, Feb. 19–22, 2024.

  • [C196] Xingquan Li, Zengrong Huang, Simin Tao, Zhipeng Huang, Chunan Zhuang, Hao Wang, Yifan Li, Yihang Qiu, Guojie Luo, Huawei Li, Haihua Shen, Mingyu Chen, Dongbo Bu, Wenxing Zhu, Ye Cai, Xiaoming Xiong, Ying Jiang, Yi Heng, Peng Zhang, Bei Yu, Biwei Xie, Yungang Bao, “iEDA: An Open-source infrastructure of EDA”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024. (paper) (slides) (Invited Paper)

  • [C195] Xingquan Li, Simin Tao, Shijian Chen, Zhisheng Zeng, Zhipeng Huang, Hongxi Wu, Weiguo Li1, Zengrong Huang, Liwei Ni, Xueyan Zhao, He Liu, Shuaiying Long, Ruizhi Liu, Xiaoze Lin, Bo Yang, Fuxing Huang, Zonglin Yang, Yihang Qiu, Zheqing Shao, Jikang Liu, Yuyao Liang, Biwei Xie, Yungang Bao, Bei Yu, “iPD: An Open-source intelligent Physical Design Tool Chain”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024. (paper) (slides) (Invited Paper)


  • [J117] Jiequan Cui, Zhisheng Zhong, Zhuotao Tian, Shu Liu, Bei Yu, Jiaya Jia, “Generalized Parametric Contrastive Learning”, IEEE Transactions on Pattern Analysis and Machine Intelligence (TPAMI), vol. 46, no. 12, pp. 7463–7474, 2024. (paper)

2023

  • [C179] Su Zheng, Bei Yu, Martin Wong, “OpenILT: An Open Source Inverse Lithography Technique Framework”, IEEE International Conference on ASIC (ASICON), Nanjing, Oct. 24–27, 2023. (paper) (slides) (Invited Paper)


2022


  • [J71] Martin Rapp, Hussam Amrouch, Yibo Lin, Bei Yu, David Z. Pan, Marilyn Wolf, Jorg Henkel, “MLCAD: A Survey of Research in Machine Learning for CAD”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 10, pp. 3162–3181, 2022. (paper) (Keynote Paper)

  • [J64] Yibo Lin, Xiaohan Gao, Tinghuan Chen, Bei Yu, “Machine learning for digital circuit backend design”, Micro/nano Electronics and Intelligent Manufacturing, vol. 2, no. 3, 2022. (in Chinese) (paper)

  • [J61] Ran Chen, Wei Zhong, Haoyu Yang, Hao Geng, Fan Yang, Xuan Zeng, Bei Yu, “Faster Region-based Hotspot Detection”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 3, pp. 669–680, 2022. (code) (paper)

2021

  • [C118] Tinghuan Chen, Qi Sun, Bei Yu, “Machine Learning in Nanometer AMS Design for Reliability”, IEEE International Conference on ASIC (ASICON), Kunming, China, Oct. 26–29, 2021. (paper) (slides) (Invited Paper)

  • [C116] Wei Li, Guojin Chen, Haoyu Yang, Ran Chen, Bei Yu, “Learning Point Clouds in EDA”, ACM International Symposium on Physical Design (ISPD), Mar. 21–Mar. 24, 2021. (paper) (slides) (Invited Paper)

  • [C111] Hongjia Li, Mengshu Sun, Tianyun Zhang, Olivia Chen, Nobuyuki Yoshikawa, Bei Yu, Yanzhi Wang, Yibo Lin, “Towards AQFP-Capable Physical Design Automation”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Feb. 01–05, 2021. (paper)


  • [J58] Wei Li, Yuzhe Ma, Qi Sun, Lu Zhang, Yibo Lin, Iris Hui-Ru Jiang, Bei Yu, David Z. Pan, “OpenMPL: An Open Source Layout Decomposer”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 40, no. 11, pp. 2331–2344, 2021. (paper)

  • [J56] Guyue Huang, Jingbo Hu, Yifan He, Jialong Liu, Mingyuan Ma, Zhaoyang Shen, Juejian Wu, Yuanfan Xu, Hengrui Zhang, Kai Zhong, Xuefei Ning, Yuzhe Ma, Haoyu Yang, Bei Yu, Huazhong Yang, Yu Wang, “Machine Learning for Electronic Design Automation: A Survey”, ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 25, no. 5, 2021. (paper)

2020


2019

  • [C80] Bentian Jiang, Xiaopeng Zhang, Ran Chen, Gengjie Chen, Peishan Tu, Wei Li, Evangeline F. Y. Young, Bei Yu, “FIT: Fill Insertion Considering Timing”, ACM/IEEE Design Automation Conference (DAC), pp. 221:1–221:6, Las Vegas, NV, June 2–6, 2019. (paper) (slides) (poster)


2018


2017

  • [C57] Hang Zhang, Fengyuan Zhu, Haocheng Li, Evangeline F. Y. Young, Bei Yu, “Bilinear Lithography Hotspot Detection”, ACM International Symposium on Physical Design (ISPD), pp. 7–14, Portland, OR, Mar. 19–22, 2017. (paper) (Best Paper Award)


2016


2015


2014

2013


2012

  • [C13] Bei Yu, Jhih-Rong Gao, Duo Ding, Yongchan Ban, Jae-Seok Yang, Kun Yuan, Minsik Cho, David Z. Pan, “Dealing with IC Manufacturability in Extreme Scaling”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), pp. 240–242, San Jose, Nov. 5–8, 2012. (paper) (Embedded Tutorial paper)


2011

2010

2009



Books / Book Chapters

 

[B4] Haoyu Yang, Yibo Lin, Bei Yu, “Machine Learning for Mask Synthesis and Verification”, in Machine Learning Applications in Electronic Design Automation, Mark Ren eds., Springer, 2022. (paper)

 

[B3] Shiyan Hu, Bei Yu, “Big Data Analytics for Cyber-Physical Systems”, Springer, 2020.

 

[B2] Bei Yu, David Z. Pan, “Design for Manufacturability with Advanced Lithography”, Springer, 2016.

 

[B1] Bei Yu, David Z. Pan, “Layout Decomposition for Triple Patterning”, in Encyclopedia of Algorithms, M.-Y. Kao eds., Springer, 2015. (paper)


Dissertation

Newsletters

  • [N2] Bei Yu, Gilda Garreton, David Z. Pan, “Layout Compliance for Triple Patterning Lithography: An Iterative Approach”, SPIE Newsroom.