Professional Services

University Committee Assignments

• Assistant Dean (Mainland Affairs), Faculty of Engineering, 2025–present.

• Engineering Panel, Research Grants Council (RGC), 2026–present.

• Executive Committee Member, Shenzhen Research Institute (SZRI), 2026–present.

• Chair, Department Internship and Industry Liaison, 2023–present.

• Member, Department Graduate Panel, 2016–2023.

• Member, Department Curriculum Committee, 2015–present.

Editorial Board

• Editor, IEEE Technical Committee on Cyber-Physical Systems (TC-CPS) Newsletter, 2019–2021.

• Associate Editor, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2024–present.

• Associate Editor, ACM Transactions on Design Automation of Electronic Systems (TODAES), 2020–present.

• Associate Editor, Integration, the VLSI Journal, 2016–present.

• Associate Editor, IET Cyber-Physical Systems: Theory & Applications, 2016–2023.

Selected Organizers

• Chair, ACM Student Research Competition at ICCAD, 2018, 2019.

• Assistant Young Professionals Rep (VP), IEEE CEDA, 2025–present.

• Assistant Vice President Publicity, IEEE CEDA, 2024–2025.

• Organizing Committee, ACM International Symposium on Physical Design (ISPD), 2026–.

• Organizing Committee, IEEE CEDA Hong Kong Chapter, 2017–2024.

• Organizing Committee, International System Design Contest at DAC, 2018, 2019.

• Organizing Committee, EDAthon, 2017, 2018, 2019, 2021, 2022 (Chair)

Selected PC Member

• TPC Chair, IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), 2029.

• TPC Chair, ACM International Symposium on Physical Design (ISPD), 2028.

• TPC Chair, International Symposium of EDA (ISEDA), 2026.

• TPC Co-Chair, IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), 2028.

• TPC Co-Chair, IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), 2026.

• TPC Co-Chair, International Symposium of EDA (ISEDA), 2025.

• TPC Co-Chair, ACM/IEEE Workshop on Machine Learning for CAD (MLCAD), 2019.

• Area Chair, ACL Rolling Review (ARR), 2025, 2026.

• PC/SPC, AAAI Conference on Artificial Intelligence (AAAI), 2023, 2024, 2025, 2026.

• ACM/IEEE Workshop on Machine Learning for CAD (MLCAD), 2019, 2020, 2021, 2022, 2023, 2024, 2025.

• ACM/IEEE Design Automation Conference (DAC), 2016, 2017, 2018.

• ACM International Symposium on Physical Design (ISPD), 2017, 2018, 2019, 2020, 2023, 2024, 2025.

• ACM Great Lakes Symposium on VLSI (GLSVLSI), 2016, 2017, 2018 (CAD track chair).

• IEEE/ACM International Conference On Computer Aided Design (ICCAD), 2016, 2017, 2018, 2024, 2025, 2026 (track chair).

• IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), 2020, 2021.

• IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), 2018, 2019, 2020, 2021, 2022 (DFM track chair), 2024 (DFM track chair), 2025 (DFM track chair), 2026 (DFM track chair), 2027 (DFM track chair).

• IEEE International Conference on Computer Design (ICCD), 2021, 2022.

• IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS), 2022 (track chair)

• IEEE International Conference on LLM-Aided Design (LAD), 2024, 2025.

• International Joint Conference on Artificial Intelligence (IJCAI), 2020.

• IEEE International Conference on Integrated Circuits, Technologies & Applications (ICTA), 2026 (EDA track chair)

• International Symposium on Integrated Circuits and Systems Design (SBCCI), 2018 (CAD Track Co-Chair), 2019 (CAD track chair).