Towards Scalable, Secure and Privacy-Preserving Metaverse
The metaverse is essentially constructed by multiple technologies, including virtual reality (VR), augmented reality (AR), mixed reality (MR), artificial intelligence (AI), digital twin (DT), blockchain, and 5G communications. The advent of the metaverse has proliferated a number of VR/AR apps on top of diverse VR/AR devices, such as Meta Quest 2, MS Hololens, Sony PlayStation VR, ByteDance Pico, and Apple Vision Pro. Meanwhile, diverse metaverse applications have emerged, such as gaming, healthcare, industry, creator economy, and digital arts. However, the current development of the metaverse is still in its early stage because of the complexity and heterogeneity of the entire system, which cannot be scalable to fulfill the increasing number of participants as well as the stringent demands of metaverse applications. Moreover, emerging security vulnerabilities and privacy-leakage concerns have also prevented the metaverse from wide adoption. In this talk, I will first briefly review the Metaverse as well as relevant technologies. I will then elaborate on its challenges as well as potential solutions. Finally, I will discuss several future directions in this promising area.
Hong-Ning Dai is an associate professor in the Department of Computer Science, Hong Kong Baptist University (HKBU). He obtained a Ph.D. degree in Computer Science and Engineering from The Chinese University of Hong Kong. Before joining HKBU, he has more than 10-year academic experience in the Chinese University of Hong Kong, Macau University of Science and Technology (Macau), and Lingnan University (Hong Kong). His current research interests include the Internet of Things, Blockchain, and Big Data Analytics. Prof. Dai has published more than 200 papers in referred journals and conferences. His publications have received more than 15,000 citations. He was also included in the world’s top 2% scientists for career-long impact (2022, 2021) by Stanford University, USA. He was also conferred on AI 2000 Most Influential Scholar Award (Honorable Mention) in Internet of Things, 2023. He is the holder of 1 U.S. patent. He is the senior member of IEEE and ACM. Prof. Dai has served as an associate editor for IEEE Communications Surveys & Tutorials, IEEE Transactions on Intelligent Transportation Systems, IEEE Transactions on Industrial Informatics, IEEE Transactions on Industrial Cyber-Physical Systems, Ad Hoc Networks (Elsevier), and Connection Science (Taylor & Francis).
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