M.E. (Tsinghua), Ph.D. (Texas)
Professor

Research Areas
  • Applications
  • Artificial Intelligence
    • Deep Learning
  • Computer Engineering
    • Computer Architecture
    • Intelligent System Integration & Design
    • VLSI Computer-Aided Design
  • Rich Media
    • Computer Vision

Links

  • Associate Editor, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD)
  • Associate Editor, ACM Transactions on Design Automation of Electronic Systems (TODAES)
  • Associate Editor, Integration, the VLSI Journal

Biography

Bei Yu is a Professor in the Department of Computer Science and Engineering, and Assistant Dean (Mainland Affairs) in the Engineering Faculty, at The Chinese University of Hong Kong. His research interests include machine learning and deep learning with applications in electronic design automation (EDA) and computer vision. He served as TPC Chair of ACM/IEEE Workshop on Machine Learning for CAD (MLCAD) 2019, International Symposium of EDA (ISEDA) 2025 & 2026, ACM International Symposium on Physical Design (ISPD) 2028, and IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC) 2029, in the program committees of DAC, ICCAD, DATE, ASPDAC, ISPD, AAAI, and in the editorial boards of IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), ACM Transactions on Design Automation of Electronic Systems (TODAES), and Integration, the VLSI Journal.

Achievements and Awards
  • Best Paper Award, ICCAD 2024
  • Best Paper Award, TSM 2022
  • Best Paper Award, DATE 2022
  • Best Paper Award, ICCAD 2021
  • Best Paper Award, ASPDAC 2021
  • Best Paper Award, Integration, VLSI Journal 2018
  • Best Paper Award, ISPD 2017
  • Best Paper Award, ICCAD 2013
  • Best Paper Award, ASPDAC 2012
  • Best Student Paper Award, ICTAI 2019
  • Best Student Paper Award, ICTAI 2016
  • Research Fellow Scheme (RFS), RGC 2024 
  • Under-40 Innovator Award, DAC 2024 
  • Distinguished Lecturer, IEEE CEDA 2024
  • Mid-Career Award, IEEE TCSDM 2022 
  • Ernest S. Kuh Early Career Award, IEEE CEDA 2022