Extracted from CUHK in Focus, dated 11 Feb 2026
The latest generation of semiconductor chips requires packaging components with different functions, sizes and materials into a single multi-layered system. This process, known as 3D heterogeneous integration, boosts performance far beyond traditional 2D chips. However, it also creates complex design challenges that current EDA tools struggle to manage effectively and automatically.
The EDA software that Professor Young’s team is developing seeks to eliminate this bottleneck by combining GPU acceleration, LCM and AI technologies. This advanced system will optimise the placement of billions of components in 3D space and enable elements to operate seamlessly within a single chip. It can also simulate signal transmission, current flow and power usage, using AI to detect and refine potential issues.
The team looks forward to superior chip design tools that drive faster, more powerful and more compact electronic devices for users worldwide.
