| Title: | New Dimension for High Performance --- 3D IC Design |
| Date: |
May 29, 2009 (Friday)
|
| Time: |
11:00 a.m. - 12:00 noon
|
| Venue: |
Room 121, 1/F, Ho Sin-hang Engineering Building,
The Chinese University of Hong Kong, Shatin, N.T. |
| Speaker: |
Professor Yuan Xie
Department of Computer Science and Engineering The Pennsylvania State University USA |
As technology scales, interconnects have become a major performance bottleneck and a major source of power consumption for nanoscale VLSI chips. One promising option is 3D ICs where a stack of multiple device layers, with Through-Silicon-Vias (TSVs) going through them, are put together on the same chip. As fabrication of 3D integrated circuits has become viable, developing CAD tools and circuit/architectural techniques are imperative to explore the design space for 3D IC design. In this talk, an overview of the on-going research on 3D ICs will be presented, with the discussion on EDA design tools that can enable the adoption of 3D ICs, and novel 3D architectures that could be realized by using 3D integrations. (Details of the 3D research could be found at http://www.cse.psu.edu/~yuanxie/3d.html)
BIOGRAPHY:
Yuan Xie is Associate Professor in Computer Science and Engineering department at the Pennsylvania State University. He received Ph.D. degrees in electrical engineering from Princeton University. Before joining Penn State in Fall 2003, he was with IBM Microelectronic Division. He was a recipient of the SRC Inventor Recognition Award in 2002, NSF CAREER award in 2006, and IBM Faculty Award in 2008. He also received Best Paper Award in ASP-DAC 2008, and Best Paper Award Nomination in ICCAD 2006 and ASP-DAC 2009. He is currently Associate Editor for IEEE Transaction on VLSI and IET Computers and Digital Techniques. He was the guest co-editor for ACM Journal on Emerging Technologies for Computer Systems for special issue on 3D ICs in 2008, and IEEE Design & Test of Computers for special issue on 3D ICs in 2009. He is currently working on a book titled "3D ICs: Design, CAD, and Architecture", which will be published by Springer in 2009. More information can be found at http://www.cse.psu.edu/~yuanxie
Enquiries: Miss Temmy So at tel 2609 8444
For more information, please refer to http://www.cse.cuhk.edu.hk/seminar