| Title: | Challenges with 3D integration of circuits |
| Date: |
July 23, 2008 (Wednesday)
|
| Time: |
2:30 p.m. - 3:30 p.m.
|
| Venue: |
Room 121, 1/F, Ho Sin-hang Engineering Building,
The Chinese University of Hong Kong, Shatin, N.T. |
| Speaker: |
Mr. T.M. Mak
Senior Research Scientist Intel Corporation's Design Technology Group |
As much as Moore's Law has been driving integration for the past 40 years, integration has been on a 2D plane. With devices shrinking down to the atomic level and fabrication process increasingly more complex, why don't we look at integrating with the third dimension as well? Technology to integrate dices has matured over the years, and there seems to be lots of advantages for this form of integration. So, what are the real driving force for this technology and what are the limiters? This talk will analyze the 3D integration landscape, processor technology trend, physical issues with this form of integration and eventually show the real limiter in 3D integration. Some possible technologies that can overcome this roadblock will also be shared and discussed.
BIOGRAPHY:
TM Mak is an Engineering Manager with Intel Corporation's Sort/Test Technology Development Group, leading test methodology research. He has been with Intel for over 24 years and has worked on a variety of areas including test development, product engineering, design automation and design for test. He had served 2 terms to mentor MARCO/FCRP (Focus Center Research Program) research. He twice (1997 and 2004) received the SRC Outstanding Industrial Mentor Award. His current research interest ranges from defect based testing, fault effects as a result of nanometer technology, circuit level and physical design test issues, IO interface and analog testing, fault tolerant and on-line testing. He received the best paper award in 2004 International Test Conference and a best panel award from 2004 VTS. He currently holds 13 patents with 2 more pending. He had served on the program committees of various conferences and workshops. He is a Senior Member of IEEE and a graduate from Hong Kong Polytechnic University.
Enquiries: Miss Temmy So at tel 2609 8444
For more information, please refer to http://www.cse.cuhk.edu.hk/seminar