| Title: | An Introduction to Design for Manufacturability (DFM) |
| Date: |
November 2, 2006 (Thursday)
|
| Time: |
10:30 a.m. - 11:30 a.m.
|
| Venue: |
Room 1021, 10/F, Ho Sin-hang Engineering Building,
The Chinese University of Hong Kong, Shatin, N.T. |
| Speaker: |
Dr. Charles Chiang
Advanced Technology Group at Synopsys, Inc. Beijing, China |
The presentation will begin with a brief introduction on the yield loss on three major factors in 65nm and below technology. There are random defect due to particles, shape variation due to lithography, and thickness variation due to Chemical Mechanical Polishing (CMP). Then Dr. Chiang will address the solutions present for each yield loss factor, including both analysis and optimization. He will cover fast critical area calculation (analysis) and wire spreading (optimization) for random defect. Then he will present the chemical mechanical polishing (CMP) modeling (analysis) for Copper (Cu) and its model based dummy filling (optimization). Dr. Chiang will conclude the discussion with lithography-related yield loss.
BIOGRAPHY:
Charles Chiang received his Bachelors degree from the Department of Computer Science, New Mexico State University and his Masters and Ph.D., from the Department of Electrical Engineering and Computer Science, Northwestern University, Illinois in 1988 and 1991, respectively.
After working at IBM and other EDA companies for 10 years, he joined the Advanced Technology Group at Synopsys, Inc. in 2001. His research interests include routing, placement, floorplan, and signal integrity. His main research focus is now on design for manufacturability (DFM).
Dr. Chiang has been a Senior Member of IEEE since 1998. He received the Superior Design Recognition award and the ADAL award from IBM Rochester in 1993 and 1994, respectively. He has served on the technical committee of ICCAD from 2004 to 2006, on that of Field Programming Logic (FPL) from 2002 to 2003, as well as on the committee of ASP-DAC in 2007. He has published approximately 40 papers and filed 11 US patents.
Enquiries: Miss Temmy So at tel 2609 8444
For more information, please refer to http://www.cse.cuhk.edu.hk/seminar