The Chinese University of Hong Kong
Department of Computer Science and Engineering


Title: A Novel Cross-Layer Framework for Early-Stage Power Delivery and Architecture Co-Exploration
Date: August 30, 2016 (Tuesday)
Time: 4:00 p.m. - 5:00 p.m.
Venue: Room 121, 1/F, Ho Sin-hang Engineering Building,
The Chinese University of Hong Kong,
Shatin, N.T.
Speaker: Prof. Yiyu Shi
Associate Professor
Department of Computer Science and Engineering
University of Notre Dame, Indiana, US



With the reduced noise margin brought by relentless technology scaling, power integrity assurance has become more challenging than ever. On the other hand, traditional design methodologies typically focus on a single design layer without much cross-layer interaction, potentially introducing unnecessary guard-band and wasting significant design resources. Both issues imperatively call for a cross-layer framework for the co-exploration of power delivery (PD) and system architecture, especially in the early design stage with larger design and optimization freedom. Unfortunately, such a framework does not exist yet in the literature. As a step forward, this talk provides a run-time simulation framework of both PD and architecture and captures their interactions. Enabled by the proposed recursive run-time PD model, it handles an entire SoC PD system on-the-fly simulation with <1% deviation from SPICE. Moreover, with a seamless interaction among architecture, power and PD simulators, it has the capability to simulate benchmarks with millions of cycles within reasonable time. A support vector regression (SVR) model is also employed to further speed up power estimation of functional units to millions cycle/second with good accuracy. The experimental results of running PARSEC suite have illustrated the framework's capability to explore hardware configurations to discover the co-effect of PD and architecture for early stage design optimization. Moreover, it also illustrates multiple over-pessimism in traditional methodologies. For example, by capturing the closed-loop PD and system interaction, the peak-to-peak noise shows 10% reduction, with potentially 7% power saving.



Prof. Yiyu Shi is currently an associate professor in the Department of Computer Science and Engineering and Electrical Engineering (concurrent appointment) at the University of Notre Dame, and the director of Sustainable Computing Lab (SCL) . He received his B.S. degree (with honor) in Electronic Engineering from Tsinghua University, Beijing, China in 2005, the M.S and Ph.D. degree in Electrical Engineering from the University of California, Los Angeles in 2007 and 2009 respectively. He was an assistant professor in the Electrical and Computer Engineering Department at Missouri University of Science and Technology from 2010 to 2015, where he was the site founding co-director of the NSF I/UCRC Net-Centric Software and Systems Center. His current research interests include low-power design, three-dimensional integration, hardware security and renewable energy applications. In recognition of his research, eight of his papers have been nominated for the Best Paper Award and one paper have received the Best Paper in Track, all in top conferences (DAC'05, ICCAD'07, ICCD'08, ASPDAC'09, DAC'09, ISPD'13, ICCAD'14, ISPD'15, DAC'16). He was also the recipient of IBM Invention Achievement Award in 2009, Japan Society for the Promotion of Science (JSPS) Faculty Invitation Fellowship, Humboldt Research Fellowship, IEEE St. Louis Section Outstanding Educator Award, Academy of Science (St. Louis) Innovation Award, Missouri S&T Faculty Excellence Award, NSF CAREER Award, IEEE Region 5 Outstanding Individual Achievement Award, all in 2014, and the Air Force Summer Faculty Fellowship in 2015 and 2016. He has served on the technical program committee of many international conferences including DAC, ICCAD, DATE, ISPD, ASPDAC and ICCD. He is also a member of IEEE CEDA Publicity Committee and IEEE Smart Grid R&D Committee, and an associate editor of IEEE TCAD, ACM JETC, VLSI Integration, IEEE VLSI CAS Newsletter, IEEE TCCCPS Newsletter and ACM SIGDA Newsletter. He is a senior member of IEEE.


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